公开(公告)号：US06543988B2

公开(公告)日：2003-04-08

申请号：US09908528

申请日：2001-07-18

申请人： Yi-Li Hsiao ,  Cheng-Chieh Hung ,  Yu-Tsung Fu ,  Weng-Liang Fang

发明人： Yi-Li Hsiao ,  Cheng-Chieh Hung ,  Yu-Tsung Fu ,  Weng-Liang Fang

IPC分类号： B25J915

CPC分类号： H01L21/67259 ,  B25B5/147 ,  B25J9/107 ,  B25J15/10 ,  H01L21/68707

摘要： A wafer is carried on a blade supported on robotic arms. A plurality of guide clamps both move the wafer into a desired position on the blade and clamp the wafer in place during transport by the arms. The clamps are reciprocally mounted on the blade and are connected with and driven by a rotatable hub carried on the blade and rotated by the movement of the arms. Both the blade and the clamps include beveled surfaces that guide the wafer into place. The operation of the clamps is controlled by a laser that detects when the wafer is out of place or tilted on the blade.

摘要翻译： 晶片承载在机器人手臂上的刀片上。 多个引导夹具将晶片移动到刀片上的期望位置，并且在通过臂传送期间将晶片夹紧就位。 夹具相互安装在叶片上并与托架在叶片上的可旋转轮毂连接并由其驱动，并通过臂的运动而旋转。 刀片和夹具都包括将晶片引导到位的斜面。 夹具的操作由激光器控制，该激光器检测晶片何时不在位置或在叶片上倾斜。