公开(公告)号：US20040235402A1

公开(公告)日：2004-11-25

申请号：US10442900

申请日：2003-05-20

申请人： MEMC Electronic Materials, Inc.

发明人： Mick Bjelopavlic ,  Alexis Grabbe ,  Michele Haler ,  Tracy M. Ragan

IPC分类号： B24B007/00

CPC分类号： B24B37/28

摘要： A wafer carrier for retaining at least one semiconductor wafer in a processing apparatus during a processing operation which removes wafer material by at least one of abrading and chemical reaction. The processing apparatus is adapted for removing wafer material from a front side and a back side of each wafer simultaneously. The carrier includes a plate including wafer contaminating material and having an opening and a thickness. An insert has a thickness and is disposed in the opening for receiving at least one wafer and engaging a peripheral edge of the wafer to hold the wafer as the carrier rotates. The thickness of the insert is significantly greater than the thickness of the plate to inhibit removal of material from the plate and thereby inhibit bulk metal contamination of the wafer.

摘要翻译： 一种用于在处理操作期间将至少一个半导体晶片保持在处理装置中的晶片载体，其通过研磨和化学反应中的至少一种去除晶片材料。 处理装置适用于同时从每个晶片的前侧和后侧去除晶片材料。 载体包括包括晶片污染材料并具有开口和厚度的板。 插入件具有厚度并且设置在开口中，用于接收至少一个晶片并与晶片的周边边缘接合以在托架旋转时保持晶片。 插入件的厚度显着大于板的厚度，以阻止材料从板上移除，从而抑制晶片的大量金属污染。

公开(公告)号：US20040219868A1

公开(公告)日：2004-11-04

申请号：US10834533

申请日：2004-04-29

申请人： Kai R & D Center Co., Ltd.

发明人： Ikuo Ikegaki ,  Takashi Shimizu ,  Katsuya Tanaka

IPC分类号： B24B007/00

CPC分类号： B24B3/54

摘要： A blade sharpener for grinding a kitchen knife, etc. in which two separate rotary shafts are provided in parallel, at least one whetstone is mounted on each one of the rotary shafts, the circumferential surface of the whetstone forms a grinding surface, the whetstone on one rotary shaft and the whetstone on the other rotary shaft are positionally shifted in the axial direction of the rotary shafts, and the cutting edge of the blade of kitchen knife is ground by moving the blade in the axial direction of the rotary shafts while applying the cutting edge to the grinding surfaces of the whetstones.

摘要翻译： 用于研磨平行设置有两个分离的旋转轴的厨刀等的刀片磨刀机，在每个旋转轴上安装至少一个砂轮，砂轮的圆周表面形成研磨表面，磨石在 一个旋转轴和另一个旋转轴上的砂轮在旋转轴的轴向方向上位置偏移，并且通过沿着旋转轴的轴向移动叶片来研磨厨刀的刀片的切割刃，同时施加 切削刃到磨石的研磨表面。

公开(公告)号：US20040180613A1

公开(公告)日：2004-09-16

申请号：US10807853

申请日：2004-03-24

发明人： Poul Lundum

IPC分类号： B24B001/00 ,  B24B007/00

CPC分类号： B24B19/24 ,  B24B7/06 ,  B24B7/12 ,  B24B7/28 ,  B24B27/0076 ,  B24B41/047 ,  B24D13/14

摘要： An abrading machine is disclosed for abrasion of substantially plane items by use of rotating abrading discs, which are moved simultaneously forwards and backwards transverse to the item and which preferably has downward extending abrasive lamellae. The machine also preferably includes one, typically two, opposite rotating abrading cylinders fitted with elongated abrasive elements radially mounted on the abrading cylinder and has abrasive lamellae extending outwards from the cylinder. By moving the abrading discs in a reciprocatory movement transverse to the direction of feed of the items it is achieved that traces etc. from the different abrasive properties of the abrading discs are eliminated as well as all parts of milled out areas etc. are evenly abraded, particularly if the abrading device is designed for using abrading discs with abrasive means comprising abrasive lamellae made of abrasive cloth and which extend downwards from the face of the abrading disc.

摘要翻译： 公开了一种研磨机，用于通过使用旋转研磨盘来磨损基本上平面的物品，该旋转研磨盘同时向前和向后横向于物品移动，并且优选地具有向下延伸的磨料薄片。 机器还优选地包括一个通常两个相对的旋转研磨缸，其配有径向安装在研磨缸上的细长磨料，并具有从气缸向外延伸的研磨片。 通过沿着与物品的进给方向横切的往复运动来移动研磨盘，可以消除来自研磨盘的不同研磨性能的痕迹等以及磨碎区域的所有部分等均匀磨损 特别是如果研磨装置被设计成使用研磨装置的研磨装置，该研磨装置包括由研磨布制成的磨料薄片并且从研磨盘的表面向下延伸。

公开(公告)号：US20040116058A1

公开(公告)日：2004-06-17

申请号：US10318787

申请日：2002-12-13

申请人： Eastman Kodak Company

发明人： Stephen C. Meissner

IPC分类号： B24B007/00 ,  B24B009/00 ,  B24B005/00 ,  B24B007/16 ,  B23F021/03 ,  B23F021/23 ,  B24B033/00

CPC分类号： B24B13/01

摘要： A precision sub-aperture polishing tool has a compliant, toroidal polishing member mountable to a support member. A circumferential portion of the polishing member extends uniformly beyond the peripheral surface of the support member and forms a clearance with the work piece surface during polishing operations.

摘要翻译： 精密子孔抛光工具具有可安装到支撑构件的柔性环形抛光构件。 研磨部件的圆周部分在抛光操作期间均匀地延伸超过支撑部件的周面并与工件表面形成间隙。

公开(公告)号：US20040116055A1

公开(公告)日：2004-06-17

申请号：US10321019

申请日：2002-12-17

发明人： Daniel D. Friel SR.

IPC分类号： B24B007/00

CPC分类号： B24B3/54

摘要： A finishing apparatus modifies the physical structure along the edge of a metal knife blade wherein the edge is formed at the junction of two edge facets presharpened with abrasives. The finishing apparatus consists of at least one precision angular knife guide that positions the edge of the blade into contact with the rigid surface of a driven moving member and positions the plane of the adjacent edge facet at a precise predetermined angle relative to the plane of the rigid surface that is harder than the metal of the knife and is without tendency to abrade.

摘要翻译： 整理装置沿着金属刀片的边缘改变物理结构，其中边缘形成在预先用磨料磨削的两个边缘面的交界处。 精加工设备包括至少一个精密角刀引导件，其将刀片的边缘定位成与被驱动的移动部件的刚性表面接触，并将相邻边缘刀片的平面相对于刀片的平面定位成精确的预定角度 刚性表面比刀具金属硬，不易磨损。

公开(公告)号：US20040106363A1

公开(公告)日：2004-06-03

申请号：US10364359

申请日：2003-02-12

发明人： You Ishii ,  Masayuki Nakanishi ,  Kenro Nakamura

IPC分类号： B24B007/00

CPC分类号： B24B9/065 ,  B24B21/002

摘要： A substrate processing apparatus according to the present invention has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

摘要翻译： 根据本发明的基板处理装置具有研磨带和用于将研磨带压靠在半导体晶片的周边部分上的抛光头。 基板处理装置由于研磨带和晶片的滑动接触而抛光晶片。 抛光头具有用于支撑研磨带的弹性体。 基板处理装置具有用于按压抛光头的气缸，使得抛光头的弹性体以恒定的力将抛光带压在晶片的预定部分上。

公开(公告)号：US20040029501A1

公开(公告)日：2004-02-12

申请号：US10399949

申请日：2003-08-01

发明人： Stephen Victor Middleton ,  John Edmund Leigh Kruger

IPC分类号： B24B007/00

CPC分类号： B24B37/26 ,  B24D7/06

摘要： Working plate (10) is formed of forty-eight sections (10null), with groove (12) extending through the majority of the thickness of the plate. In one form, dovetail grooves are machined to the back of the sections of the plates (10null) attached to the base plate (19). In an alternative arrangement, fixing rails are attached to the backs of the sections and the dovetail grooves are in the base plate (19).

摘要翻译： 工作板（10）由四十八个部分（10'）形成，其中凹槽（12）延伸穿过板的大部分厚度。 在一种形式中，将燕尾槽加工到附接到基板（19）的板（10'）的部分的后部。 在另一种布置中，固定导轨附接到部分的后部，燕尾槽位于基板（19）中。

公开(公告)号：US20040018810A1

公开(公告)日：2004-01-29

申请号：US10381526

申请日：2003-03-26

发明人： Makoto Ueno

IPC分类号： B24B005/00 ,  B24B007/00

CPC分类号： B24D9/003 ,  B24B23/005 ,  B24D15/04

摘要： A polishing device capable of polishing a repaired surface in a specified shape, comprising a polishing panel body holding a polishing material on a surface opposed to the repaired surface and polishing the repaired surface in the specified shape with the polishing material and a holding part installed on the polishing panel body and held when the polishing panel body is operated, wherein the holding part is installed on the polishing panel body rotatably about an axis set on the polishing panel body, whereby a controllability can be improved, the labor of a worker can be reduced, and the disturbance of smoothness on the repaired surface and the premature wear of sand paper can be suppressed.

摘要翻译： 一种抛光装置，其能够以特定形状抛光被修复的表面，该抛光装置包括：抛光板主体，其在与修复表面相对的表面上保持抛光材料，并用抛光材料抛光指定形状的修复表面，并将保持部件安装在 抛光面板主体并且当抛光面板主体被操作时保持，其中保持部分围绕设置在抛光面板主体上的轴线可旋转地安装在研磨面板体上，由此可以提高可控性，劳动者可以 可以抑制修复后的平滑度的干扰和砂纸的过早磨损。

公开(公告)号：US20030236060A1

公开(公告)日：2003-12-25

申请号：US10175358

申请日：2002-06-19

发明人： Mark Opfer ,  Brad Borkosky ,  John Harkness

IPC分类号： B24B001/00 ,  B24B007/00

CPC分类号： B23Q7/165 ,  B24B9/102 ,  B24B41/005

摘要： A single-sided finishing apparatus is provided having a plurality of finishing stations with rotating transfer stations positioned therebetween. A hold down system presents the edge of the workpiece to the finishing head. The rotating transfer station includes a clamp for grasping a leading corner of a workpiece while rollers continue to drive the workpiece forward, thereby rotating the workpiece 90null.

摘要翻译： 提供了具有多个精加工台的单面精加工设备，其间设置有转动传送站。 压紧系统将工件的边缘呈现到精加工头。 旋转传送站包括用于抓住工件的前角的夹具，同时辊继续向前驱动工件，从而使工件90°旋转。

公开(公告)号：US20030220051A1

公开(公告)日：2003-11-27

申请号：US10301197

申请日：2002-11-20

申请人： Taiwan Semiconductor Manufacturing Co., Ltd

发明人： Chih-Ming Chang

IPC分类号： B24B049/00 ,  B24B051/00 ,  B24B007/00

CPC分类号： B24B53/017

摘要： A conditioning disk actuating system for raising and lowering a conditioning disk inside a conditioning head for the conditioning of semiconductor wafer polishing pads. The system includes a fluid-actuated cylinder which is coupled to a travel hub vertically slidably mounted in a travel housing provided inside the conditioning head. The conditioning disk is mounted on the bottom end of a disk shaft carried by the travel hub. The fluid-actuated cylinder is operated to selectively lower and raise the travel hub and conditioning disk to press the disk against the polishing pad and remove the disk from the polishing pad, respectively. A position sensing mechanism may be provided in the conditioning head for revealing the nullupnull or nulldownnull position of the conditioning disk.