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公开(公告)号：US20210383725A1
公开(公告)日：2021-12-09
申请号：US16896166
申请日：2020-06-08
申请人： eTEP Inc.
摘要： A packaging system or tag is provided for at least one article or item, which employs a multilayer laminate structure that includes an encapsulated transformative material that is disposed between first and second conductive layers. The transformative material is configured to undergo a state change (for example, by a chemical reaction or physical change) that changes impedance between the first and second conductive layers in response to an intrusion or perforation through at least part of the multilayer laminate structure. Furthermore, one of the first and second conductive layers can be configured (for example, by printing or etching) to provide an RF antenna and a first electrode of the at least one integrated galvanic cell. The other of the first and second conductive layers can provide a second electrode of the at least one integrated galvanic cell. The at least one integrated galvanic cell is further provided by encapsulated electrolyte material and ion bridge disposed between the first and second conductive layers. At least one NFC/RFID integrated circuit is mechanically secured to the multilayer laminate structure (for example, in space between the first and second conductive layers) and electrically coupled to the coil antenna, the at least one galvanic cell, and other parts of the first and second conductive layers of the multilayer laminate structure. The galvanic cell can also be made to have long shelf life.
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公开(公告)号：US10812145B1
公开(公告)日：2020-10-20
申请号：US16448974
申请日：2019-06-21
申请人： eTEP Inc.
摘要： A packaging system for at least one article includes a multilayer laminate structure and at least one sensor. The laminate structure encapsulates a transformative material between first and second conductive layers, which undergoes a state change that changes impedance between the first and second conductive layers in response to a perforation produced by the at least one sensor. An NFC/RFID circuit is electrically coupled to the first and second conductive layers of the multilayer laminate structure. At least one operational characteristic of the NFC/RFID circuit is dependent on the impedance change between the first and second conductive layers in response to a perforation produced by the sensor under predetermined environmental conditions. The operational characteristic(s) of the NFC/RFID circuit can be ascertained and analyzed (for example, by operations of an NFC/RFID interrogator) to detect and register the predetermined environmental conditions and provide an indication thereof.
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公开(公告)号：US11030508B2
公开(公告)日：2021-06-08
申请号：US16449242
申请日：2019-06-21
申请人： eTEP Inc.
IPC分类号： G06K19/077
摘要： A packaging system for at least one article includes a multilayer laminate structure that encapsulates a transformative material between first and second conductive layers where one of the first and second conductive layers defines a set of elongate sections. An NFC/RFID IC is electrically coupled to an antenna. The NFC/RFID IC has a plurality of input terminals electrically coupled to a plurality of electrical circuits that provide for electrical connection or electrical disconnection between sections in the set of elongate sections in accordance with a predefined codeword. The NFC/RFID IC is configured to sense voltage signals produced by the plurality of electrical circuits, determine a sensed codeword based on the sensed voltage signals, compare the sensed codeword to the predefined codeword, and output a signal based on such comparison. The predefined codeword can be associated with the packaging system for the at least one article or the at least one article, and the output signal output can be related to suspected counterfeiting or falsification of the at least one article. The NFC/RFID IC or an additional NFC/RFID IC can be configured to detect and register an intrusion or perforation in the multilayer laminate structure that relates to suspected tampering.
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公开(公告)号：US11436947B2
公开(公告)日：2022-09-06
申请号：US16896166
申请日：2020-06-08
申请人： eTEP Inc.
摘要： A packaging system or tag is provided for at least one article or item, which employs a multilayer laminate structure that includes an encapsulated transformative material that is disposed between first and second conductive layers. The transformative material is configured to undergo a state change (for example, by a chemical reaction or physical change) that changes impedance between the first and second conductive layers in response to an intrusion or perforation through at least part of the multilayer laminate structure. Furthermore, one of the first and second conductive layers can be configured (for example, by printing or etching) to provide an RF antenna and a first electrode of the at least one integrated galvanic cell. The other of the first and second conductive layers can provide a second electrode of the at least one integrated galvanic cell. The at least one integrated galvanic cell is further provided by encapsulated electrolyte material and ion bridge disposed between the first and second conductive layers. At least one NFC/RFID integrated circuit is mechanically secured to the multilayer laminate structure (for example, in space between the first and second conductive layers) and electrically coupled to the coil antenna, the at least one galvanic cell, and other parts of the first and second conductive layers of the multilayer laminate structure. The galvanic cell can also be made to have long shelf life.
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5.发明授权公开(公告)号：US10332373B1
公开(公告)日：2019-06-25
申请号：US16180512
申请日：2018-11-05
摘要： A packaging system is provided includes a sensing barrier protecting at least one article. The sensing barrier is formed from a multilayer laminate structure that encapsulates a transformative material between first and second conductive layers. The transformative material is configured to undergo a state change (for example, by a chemical reaction or physical reaction) that changes impedance between the first and second conductive layers in response to intrusion through the multilayer laminate structure. An NFC/RFID circuit is electrically coupled to the first and second conductive layers of the multilayer laminate structure. At least one operational characteristic of the NFC/RFID circuit is dependent on the change in impedance between the first and second conductive layers of the multilayer laminate structure in response to intrusion. The operational characteristic(s) of the NFC/RFID circuit can be ascertained and analyzed (for example, by suitable operations of an external NFC/RFID interrogator) to detect the intrusion and provide an indication of the intrusion if and when detected.
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