A packaging system is provided includes a sensing barrier protecting at least one article. The sensing barrier is formed from a multilayer laminate structure that encapsulates a transformative material between first and second conductive layers. The transformative material is configured to undergo a state change (for example, by a chemical reaction or physical reaction) that changes impedance between the first and second conductive layers in response to intrusion through the multilayer laminate structure. An NFC/RFID circuit is electrically coupled to the first and second conductive layers of the multilayer laminate structure. At least one operational characteristic of the NFC/RFID circuit is dependent on the change in impedance between the first and second conductive layers of the multilayer laminate structure in response to intrusion. The operational characteristic(s) of the NFC/RFID circuit can be ascertained and analyzed (for example, by suitable operations of an external NFC/RFID interrogator) to detect the intrusion and provide an indication of the intrusion if and when detected.