SMART CONNECTOR AND METHOD OF MANUFACTURING SAME USING AN APPLICATION SPECIFIC ELECTRONICS PACKAGING MANUFACTURING PROCESS

    公开(公告)号:US20250070520A1

    公开(公告)日:2025-02-27

    申请号:US18945586

    申请日:2024-11-13

    Applicant: Molex, LLC

    Abstract: In an embodiment, a smart connector includes an Application Specific Electronics Packaging device formed by an Application Specific Electronic Packaging manufacturing process, and a separate printed circuit board electrically connected to electrical components of the Application Specific Electronic Packaging device. The ASEP Application Specific Electronic Packaging manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of Application Specific Electronic Packaging devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.

    LOW-HEIGHT CONNECTOR FOR HIGH-SPEED TRANSMISSION

    公开(公告)号:US20250070514A1

    公开(公告)日:2025-02-27

    申请号:US18945587

    申请日:2024-11-13

    Applicant: Molex, LLC

    Abstract: A connector includes a first connector including a first housing, a wire held by the first housing, and a first terminal held by the first housing, including the main body part connected to a conductive wire of the wire and a contact part extending in a first direction; and a second connector including a second housing and a second terminal held by the second housing, including a contact part extending in the first direction, which is mounted on the surface of the circuit board, where the first connector is moved in the first direction with respect to the second connector, and then moved in a second direction orthogonal to the first direction with respect to the second connector to be fitted to the second connector, and the contact part of the first terminal is brought into contact with the contact part of the second terminal, when the first connector is moved in the second direction with respect to the second connector.

    HIGH-SPEED CONNECTOR SYSTEM
    3.
    发明申请

    公开(公告)号:US20250070507A1

    公开(公告)日:2025-02-27

    申请号:US18729182

    申请日:2023-01-26

    Applicant: Molex, LLC

    Abstract: A high-speed connector system includes a male connector and a female connector which are configured to be coupled together. Each connector includes a housing and a module. Each housing houses a plurality of electrical terminals in terminal receiving passageways and has walls defining a module receiving passage in which the module is seated. Each module is configured to receive an electrical terminal, and has a plurality of rounded nubs on walls forming the module which are engaged with walls forming the module receiving passage. The nubs space the module from the walls of the module receiving passage and form a ball joint to allow floating of the module relative to the housing.

    Electrical connector
    5.
    发明授权

    公开(公告)号:US12237604B2

    公开(公告)日:2025-02-25

    申请号:US17778858

    申请日:2020-12-18

    Applicant: Molex, LLC

    Abstract: An electrical connector includes an insulative housing, and a pair of contacts which are secured together by a clamp mounted within the housing. Each electrical contact includes a planar body, spring fingers extending from a first end of the body, and a coupling extending from the body to couple the electrical contacts to the housing. A first deflection zone between the clamp and first ends of the spring fingers allows the spring fingers to deflect in a lateral direction to receive the conductive component within the receiving space. A second deflection zone between the first ends of the spring fingers and the second ends of the bodies allow the bodies and spring fingers to deflect in the lateral direction when the conductive component is received within the receiving space, but the conductive component is not directly aligned with the receiving space.

    Optical modulating device
    6.
    发明授权

    公开(公告)号:US12216377B2

    公开(公告)日:2025-02-04

    申请号:US17329206

    申请日:2021-05-25

    Applicant: Molex, LLC

    Abstract: An optical modulating device of the present disclosure includes an optical splitter, an optical phase modulator and an optical combiner. The optical splitter splits an inputting optical signal by an optical splitting ratio to generate a first split optical signal and a second split optical signal. The optical phase modulator phase modulates the first split optical signal and the second split optical signal to respectively generate a first modulating optical signal and a second modulating optical signal. The optical combiner combines the first modulating optical signal and the second modulating optical signal by a combining ratio to generate an outputting optical signal having a chirp, the combining ratio being equal to the optical splitting ratio, a value of the combining ratio being a positive number, and the value being less than one or more than one.

    CABLE HARNESS WITH HYBRID HIGH SPEED SIGNAL AND POWER CONNECTORS

    公开(公告)号:US20250016948A1

    公开(公告)日:2025-01-09

    申请号:US18888197

    申请日:2024-09-18

    Applicant: Molex, LLC

    Abstract: A cable harness for use in a backplane is provided. The cable harness includes a primary hybrid signal and power backplane connector having a primary housing. The primary housing includes a primary signal pair element and a primary power connector. The cable harness also includes a secondary hybrid signal and power backplane connector having a secondary housing. The secondary housing includes a secondary signal pair element and a secondary power connector. The primary hybrid signal and power backplane connector is connected with the secondary hybrid signal and power backplane connector with a signal cable. Each of the primary and secondary hybrid signal and power backplane connectors is electrically connected with a power supply unit each via a power cable.

    CONNECTOR
    8.
    发明申请

    公开(公告)号:US20250015521A1

    公开(公告)日:2025-01-09

    申请号:US18890848

    申请日:2024-09-20

    Applicant: Molex, LLC

    Inventor: Daishi Gondo

    Abstract: A connector is provided with a half body part, each of which including a connector main body and a plurality of terminals arranged at a predetermined pitch and integrated with the connector main body by insert molding, a main body end part formed at both ends of the connector main body by coupling the connector main bodies of the half body parts arranged in parallel, and a reinforcing metal fitting integrated with the main body end part.

    Smart connector and method of manufacturing same using an application specific electronics packaging manufacturing process

    公开(公告)号:US12176659B2

    公开(公告)日:2024-12-24

    申请号:US17414352

    申请日:2020-01-22

    Applicant: Molex, LLC

    Abstract: In an embodiment, a smart connector includes an Application Specific Electronics Packaging device formed by an Application Specific Electronic Packaging manufacturing process, and a separate printed circuit board electrically connected to electrical components of the Application Specific Electronic Packaging device. The Application Specific Electronic Packaging manufacturing process includes forming a continuous carrier web having a plurality of lead frames, overmolding a substrate onto the fingers of each lead frame, each substrate having a plurality of openings which exposes a portion of the fingers, electroplating the traces, and electrically attaching at least one electrical component to the traces to form a plurality of Application Specific Electronic Packaging devices. In some embodiments, the printed circuit board has electrical components configured to control the functionality of the electrical components. In some embodiments, the printed circuit board has electrical components configured to modify properties of the smart connector.

Patent Agency Ranking