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公开(公告)号:US11411655B2
公开(公告)日:2022-08-09
申请号:US17329211
申请日:2021-05-25
Applicant: Molex, LLC
Inventor: Kuen-Ting Tsai , Yao-Wen Liang , Zuon-Min Chuang , Wei-Hung Chen
IPC: H04B10/69
Abstract: An optical receiving device includes a conversion module, a signal generation module and a control module. The conversion module performs photoelectric conversion and amplification on an optical signal to generate a photocurrent, the signal generation module provides a gain signal, performs transimpedance and amplification on the photocurrent according to an input signal indicating a preset output voltage swing to generate a voltage signal, and generates a measurement signal indicating an average optical power associated with the optical signal according to the photocurrent, the control module outputs a control signal which is variable to adjust a gain of the conversion module, so that a dynamic range of the conversion module changes as the gain of the conversion module itself changes.
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公开(公告)号:US12216377B2
公开(公告)日:2025-02-04
申请号:US17329206
申请日:2021-05-25
Applicant: Molex, LLC
Inventor: Kuen-Ting Tsai , Zuon-Min Chuang
Abstract: An optical modulating device of the present disclosure includes an optical splitter, an optical phase modulator and an optical combiner. The optical splitter splits an inputting optical signal by an optical splitting ratio to generate a first split optical signal and a second split optical signal. The optical phase modulator phase modulates the first split optical signal and the second split optical signal to respectively generate a first modulating optical signal and a second modulating optical signal. The optical combiner combines the first modulating optical signal and the second modulating optical signal by a combining ratio to generate an outputting optical signal having a chirp, the combining ratio being equal to the optical splitting ratio, a value of the combining ratio being a positive number, and the value being less than one or more than one.
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公开(公告)号:US12117661B2
公开(公告)日:2024-10-15
申请号:US17466081
申请日:2021-09-03
Applicant: Molex, LLC
Inventor: Li-Chi Yang , Bing-Hao Shih , Chih-Chung Wu , Zuon-Min Chuang
CPC classification number: G02B6/4246 , G02B6/4213 , G02B6/43 , H04B10/25891 , H04B10/40 , H04J14/02 , H04J14/06
Abstract: The present disclosure provides a photonic integrated circuit chip. The photonic integrated circuit chip comprises a plurality of connection ports, multiple polarization beam splitting structures, a photodetector structure, an interleaver and a modulator. The plurality of connection ports are used to receive a plurality of first optical signals to the photonic integrated circuit chip. The multiple polarization beam splitting structures each are used to split the first optical signal passing through the polarization beam splitting structure into a first mode optical signal and a second mode optical signal. The photodetector structure comprises a first component for split beam and a second component for split beam. The interleaver is used to transfer the first mode optical signal or the second mode optical signal to the second component for split beam. The modulator is used to transfer second optical signals with different wavelengths to the interleaver. The interleaver further transfers the second optical signals to the different connection ports according to the different wavelengths of the second optical signals.
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公开(公告)号:US12068791B2
公开(公告)日:2024-08-20
申请号:US17379110
申请日:2021-07-19
Applicant: Molex, LLC
Inventor: Thomas R. Marrapode , Zuon-Min Chuang , Sung-Ping Huang , Wenzong Chen
CPC classification number: H04B10/801 , G02B6/3882 , G02B6/3885 , G02B6/4202 , G02B6/4218 , G02B6/4238 , G02B6/4261
Abstract: An optical interconnect module for coupling a photonic integrated chip to an optical ferrule is provided. The optical interconnect module may include a coupler for interfacing to the photonic integrated chip, the coupler comprising at least one guide pin. The optical interconnect module may include an optical ferrule configured for being removably attached to the coupler, the optical ferrule comprising at least one through hole for receiving the at least one guide pin from the coupler.
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公开(公告)号:US20240319438A1
公开(公告)日:2024-09-26
申请号:US18632332
申请日:2024-04-11
Applicant: Molex, LLC
Inventor: Chih-Chung Hsu , Chih-Chung Wu , Zuon-Min Chuang
CPC classification number: G02B6/12004 , G02B6/424 , G02B6/4244 , G02B6/4245 , G02B2006/12102 , G02B6/30 , G02B6/4206
Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.
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公开(公告)号:US11656416B2
公开(公告)日:2023-05-23
申请号:US17379142
申请日:2021-07-19
Applicant: Molex, LLC
Inventor: Sung-Ping Huang , Zuon-Min Chuang
IPC: G02B6/42
CPC classification number: G02B6/4245 , G02B6/4206 , G02B6/4212 , G02B6/4239 , G02B6/4266
Abstract: The present disclosure provides an optical waveguide connection assembly and an optical module including the optical waveguide connection assembly. The optical waveguide connection assembly includes a holder, an optical fiber, a connection member and an optical coefficient adjusting member. The holder has a first part and a second part. The first part is positioned a side of the optical element, the second part is positioned above the optical element. The optical fiber is fixed to the first par. The connection member is provided between the second part and the optical element. The optical coefficient adjusting member is provided between the optical fiber and the optical element, so that a beam is capable of being transferred between the optical fiber and the optical element via the optical coefficient adjusting member. The optical waveguide connection assembly is fixed to the optical element via the connection member and the optical coefficient adjusting member.
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公开(公告)号:US20240372631A1
公开(公告)日:2024-11-07
申请号:US18774969
申请日:2024-07-17
Applicant: Molex, LLC
Inventor: Thomas R. Marrapode , Zuon-Min Chuang , Sung-Ping Huang , Wenzong Chen
Abstract: An optical interconnect module for coupling a photonic integrated chip to an optical ferrule is provided. The optical interconnect module may include a coupler for interfacing to the photonic integrated chip, the coupler comprising at least one guide pin. The optical interconnect module may include an optical ferrule configured for being removably attached to the coupler, the optical ferrule comprising at least one through hole for receiving the at least one guide pin from the coupler.
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公开(公告)号:US20240255697A1
公开(公告)日:2024-08-01
申请号:US18636312
申请日:2024-04-16
Applicant: Molex, LLC
Inventor: Chih-Chung Hsu , Chih-Chung Wu , Zuon-Min Chuang , Chih-Wei Peng
CPC classification number: G02B6/12004 , G02B6/424 , G02B6/4244 , G02B6/4245 , G02B2006/12102 , G02B6/30 , G02B6/4206
Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.
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公开(公告)号:US11988867B2
公开(公告)日:2024-05-21
申请号:US17395496
申请日:2021-08-06
Applicant: Molex, LLC
Inventor: Chih-Wei Peng , Chih-Chung Hsu , Chih-Chung Wu , Zuon-Min Chuang
CPC classification number: G02B6/12004 , G02B6/424 , G02B6/4244 , G02B6/4245 , G02B2006/12102 , G02B6/30 , G02B6/4206
Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.
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公开(公告)号:US11942993B2
公开(公告)日:2024-03-26
申请号:US17784104
申请日:2020-12-18
Applicant: Molex, LLC
Inventor: Kuen-Ting Tsai , Wei-Hung Chen , Zuon-Min Chuang , Yao-Wen Liang
IPC: H04B10/2513 , G02F1/21 , H04B1/69 , H04B10/524 , H04B10/54
CPC classification number: H04B10/25137 , G02F1/212 , H04B1/69 , H04B10/524 , H04B10/541 , H04B2001/6912
Abstract: An optical transmission device includes: a control module generate a control signal output which includes a slope adjust signal and a bias voltage offset adjust signal according to an input signal indicating a dispersion amount an electrical level adjust signal; a multi-level pulse amplitude modulator; and an asymmetrical optical modulator which is controlled by the slope adjust signal to be operated at one of a positive slope and a negative slope of a transfer function of the asymmetrical optical modulator itself, and is controlled by the bias voltage offset adjust signal of the control signal output to offset a bias voltage point of the asymmetrical optical modulator itself from a quadrature point of the transfer function, and modulates the multi-level pulse amplitude modulation signal to an optical signal to generate an optical modulate signal having a chirp.
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