MOLDED BODY MANUFACTURING METHOD
    1.
    发明公开

    公开(公告)号:US20240075662A1

    公开(公告)日:2024-03-07

    申请号:US18274424

    申请日:2022-01-11

    申请人: MICRO-AMS INC.

    发明人: Shingo KAGAWA

    IPC分类号: B29C43/52 B29C33/08

    摘要: In a molded body manufacturing method, after a raw material is put into a cavity of a mold, at least a part of the mold is irradiated with electromagnetic waves, or at least part of the mold is placed in an alternating electric field, to mold a molded body. The mold has a heating body, which absorbs the electromagnetic waves to generate heat or is placed in the alternating electric field to generate heat, outside the cavity. In at least part of a space between the heating body and the cavity, a transmission amount suppressing body that suppresses the amount of transmission of the electromagnetic waves or the alternating electric field into the cavity is provided, or at least part of the cavity is composed of the transmission amount suppressing body. When the heating body generates heat, the heat is transmitted to the raw material to perform molding.

    RESIN MOLDING METHOD
    2.
    发明申请

    公开(公告)号:US20220168968A1

    公开(公告)日:2022-06-02

    申请号:US17600720

    申请日:2020-03-24

    申请人: micro-AMS Inc.

    摘要: A resin molding method is capable of reducing the use amount of micropellets and obtaining a resin molded article having required characteristics. A resin molding method includes a disposing step of disposing a preliminary molded body laminated and formed in a three-dimensional shape in a molding die, a filling step of heating and melting the preliminary molded body by an electromagnetic wave transmitted through the molding die and filling the molding die with a molten resin material, and a cooling step of cooling and solidifying the molten resin material in the molding die. In the cooling step, a resin molded article integrated so as to eliminate a lamination interface of the preliminary molded body is formed in the molding die.