公开(公告)号：US20240204137A1

公开(公告)日：2024-06-20

申请号：US18554701

申请日：2022-04-05

申请人： ams-OSRAM International GmbH

发明人： Ali Mahdavi ,  Ines Pietzonka ,  Stefan Barthel ,  Alvaro Gomez-lglesias

IPC分类号： H01L33/24 ,  H01L25/075 ,  H01L33/62

CPC分类号： H01L33/24 ,  H01L25/0753 ,  H01L33/62

摘要： In an embodiment a radiation-emitting semiconductor chip includes a first doped region, an active region adjacent to the first doped region and a second doped region arranged on a side of the active region facing away from the first doped region, wherein the first doped region is structured in a step-like manner and includes several planes in a direction perpendicular to a main extension plane of the semiconductor chip, and wherein the active region covers the first doped region on a side surface and a top surface.