公开(公告)号：US20250160078A1

公开(公告)日：2025-05-15

申请号：US18835127

申请日：2022-12-12

Applicant: ams-OSRAM International GmbH

Inventor： Andreas REITH ,  Gunnar PETERSEN ,  Daniel RICHTER

IPC: H10H20/856 ,  H10H20/01

Abstract: An optoelectronic component includes a carrier, at least one optoelectronic semiconductor chip, which is arranged on the carrier, and a housing which comprises a molded body. The housing at least partially surrounds the optoelectronic semiconductor chip. A reflective layer is arranged on at least one side surface of the optoelectronic semiconductor chip, and the carrier includes vias.

公开(公告)号：US20250158351A1

公开(公告)日：2025-05-15

申请号：US18836056

申请日：2022-12-07

Applicant: ams-OSRAM International GmbH

Inventor： Wolfgang NEUMANN ,  Sabine VOM DORP ,  Andreas REITH

IPC: H01S5/02257 ,  H01S5/02315 ,  H01S5/042

Abstract: A radiation-emitting device includes a carrier formed to include sapphire and/or AlN. A semiconductor layer sequence is applied onto the carrier. A radiation outcoupling layer is arranged on the side of the carrier facing away from the semiconductor layer sequence, wherein the semiconductor layer sequence includes an active region for generating electromagnetic radiation, and wherein the radiation outcoupling layer has a refractive index for the electromagnetic radiation generated by the active region which is between the refractive index of the carrier and the refractive index of the medium surrounding the component. The radiation outcoupling layer is based on quartz glass. Furthermore, a method for manufacturing an optoelectronic device is disclosed.

公开(公告)号：US20230378398A1

公开(公告)日：2023-11-23

申请号：US18030725

申请日：2021-10-08

Applicant: ams-OSRAM International GmbH

Inventor： Andreas REITH ,  Joerg SORG ,  Nikolaus GMEINWIESER ,  Dominik SCHOLZ ,  Manfred WOLF

IPC: H01L33/50 ,  H01L33/46 ,  H01L33/26 ,  H01L33/00 ,  H01L33/62 ,  H01L25/16

CPC classification number: H01L33/50 ,  H01L33/46 ,  H01L33/26 ,  H01L33/0008 ,  H01L33/62 ,  H01L25/167

Abstract: The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being bevelled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.

公开(公告)号：US20240395994A1

公开(公告)日：2024-11-28

申请号：US18696972

申请日：2022-09-23

Applicant: ams-OSRAM International GmbH

Inventor： Gunnar PETERSEN ,  Andreas REITH ,  Daniel RICHTER

IPC: H01L33/62 ,  B60Q1/04 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60

Abstract: A component comprising a plurality of semiconductor chips and a carrier is disclosed, wherein the carrier has a common metallic carrier layer with a mounting surface on which the semiconductor chips are arranged. The semiconductor chips are thermally but not electrically conductively connected to the common metallic carrier layer. The carrier has a plurality of contact layers, which are arranged next to one another and next to the common carrier layer in lateral directions and are configured for electrically contacting the component and thus for electrically contacting the semiconductor chips. The carrier has an electrically insulating housing material which holds the common metallic carrier layer and the contact layers together, wherein the common metallic carrier layer and the contact layers are adjacent to the housing material and are electrically insulated from one another by the electrically insulating housing material.

公开(公告)号：US20230187588A1

公开(公告)日：2023-06-15

申请号：US18164390

申请日：2023-02-03

Applicant: Ams-OSRAM International GmbH

Inventor： Andreas REITH ,  Joerg SORG ,  Nikolaus GMEINWIESER ,  Dominik SCHOLZ ,  Manfred WOLF

IPC: H01L33/48 ,  H01L25/13 ,  H01L33/60 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L33/486 ,  H01L25/13 ,  H01L33/60 ,  H01L33/62 ,  H01L24/24 ,  H01L24/20 ,  H01L2933/0058 ,  H01L2224/214 ,  H01L2224/24137

Abstract: The invention relates to an LED package for UV light comprising an optoelectronic device which, in particular as a volume emitter, is designed to emit light in the ultraviolet spectrum during operation. The component is arranged on a carrier with two contact pads for electrical contacting. Furthermore, a frame surrounding the component and arranged on the carrier is provided with a gas-impermeable outlet region lying in a main radiation direction, so that a hermetically sealed cavity comprising an inner region of the carrier is formed, the side walls of the frame facing the optoelectronic device being beveled and opening towards the main radiation direction. An ESD protection element arranged outside the inner area on the carrier is electrically connected to at least one of the two contact pads.