公开(公告)号：US06277008B1

公开(公告)日：2001-08-21

申请号：US09291585

申请日：1999-04-12

申请人： Youko Masuta ,  Mitsuyoshi Uto

发明人： Youko Masuta ,  Mitsuyoshi Uto

IPC分类号： B24B722

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A polishing apparatus includes a polishing pad, a substrate holder, and a retainer ring. The polishing pad is adhered to a polishing table. The substrate holder urges, while it holds a substrate as a polishing target, a polishing target surface of the substrate against the polishing pad. The retainer ring is formed on a holding surface of the substrate holder to correspond to the circumference of the substrate. The retainer ring has a resin portion formed on its surface which is to come into contact with the polishing pad, and an annular resin holding portion for holding the resin portion and made of a material having a higher mechanical strength than the resin portion.

摘要翻译： 抛光装置包括抛光垫，基板保持件和保持环。 抛光垫粘附在抛光台上。 衬底保持器在将衬底保持为抛光对象的同时推动衬底的抛光对象表面抵靠抛光垫。 保持环形成在衬底保持器的保持表面上以对应于衬底的周边。 保持环具有形成在其与抛光垫接触的表面上的树脂部分和用于保持树脂部分并由具有比树脂部分更高的机械强度的材料制成的环形树脂保持部分。

公开(公告)号：US06547961B2

公开(公告)日：2003-04-15

申请号：US09825935

申请日：2001-04-05

申请人： Mitsuyoshi Uto ,  Nobuki Kondo

发明人： Mitsuyoshi Uto ,  Nobuki Kondo

IPC分类号： B01D2126

CPC分类号： B24B37/04 ,  B24B57/02

摘要： An apparatus for recycling a grinding slurry capable of effectively removing unwanted components at a reduced cost. Slurry used in a grinding treatment is at first recovered as recovery slurry. The recovery slurry is then recycled so as to obtain recycled slurry. One or more cyclone separators are provided and used for sizing the used slurry to obtain slurry particles having a predetermined particle size. The slurry having the predetermined particle size is supplied as recovery slurry. When the recovery slurry is recycled to produce recycled slurry, one or more supersonic wave generators are used for irradiating supersonic waves to the recovery slurry.

公开(公告)号：US06102788A

公开(公告)日：2000-08-15

申请号：US294677

申请日：1999-04-19

申请人： Mitsuyoshi Uto

发明人： Mitsuyoshi Uto

IPC分类号： B24B37/04 ,  B24B37/30 ,  H01L21/683 ,  B24B47/00

CPC分类号： B24B37/30 ,  H01L21/6838

摘要： A stage is provided with pressing holes arranged circumferentially and suctioning holes arranged circumferentially to be close to the outer peripheral edge side compared to the pressing holes. A cavity connected to these pressing holes and suctioning holes is provided within a wafer holder. In addition, first filters, which allow a gas to flow from the cavity side to the wafer holding surface side, are arranged between the pressing holes and the cavity. Second filters, which allow a gas to flow only from the wafer holding surface side to the cavity side, are arranged between the suctioning holes and the cavity.

摘要翻译： 在台阶上设有周向布置的按压孔，与按压孔相比外周边缘侧布置的吸孔。 连接到这些按压孔和抽吸孔的空腔设置在晶片保持器内。 此外，允许气体从空腔侧流动到晶片保持表面侧的第一过滤器布置在挤压孔和空腔之间。 允许气体仅从晶片保持表面侧流到空腔侧的第二过滤器布置在吸入孔和空腔之间。