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1.发明申请Adhesive Sheet for a Stealth Dicing and a Production Method of a Semiconductor Wafer Device 有权用于隐形切割的粘合片和半导体晶片装置的制造方法公开(公告)号：US20110136322A1
公开(公告)日：2011-06-09
申请号：US12958446
申请日：2010-12-02
Applicant: Yosuke Sato , Masatomo Nakamura
Inventor： Yosuke Sato , Masatomo Nakamura
CPC classification number: C09J7/245 , C09J2201/622 , C09J2203/326 , C09J2427/006 , C09J2433/00 , Y10T428/265 , Y10T428/266 , Y10T428/28 , Y10T428/2852
Abstract: An adhesive sheet is provided enabling to efficiently produce the very small size semiconductor chip by a stealth dicing method. An adhesive sheet for a stealth dicing includes a substrate and an adhesive layer formed on one side of the substrate, wherein a Young's modulus of the adhesive sheet at 23° C. is 200 to 600 MPa, and a storage elastic modulus of the adhesive layer at 23° C. is 0.10 to 50 MPa.
Abstract translation: 提供了能够通过隐形切割方法有效地生产非常小尺寸的半导体芯片的粘合片。 用于隐形切割的粘合片包括基材和形成在基材的一侧上的粘合剂层，其中粘合片在23℃下的杨氏模量为200至600MPa，并且粘合剂层的储能弹性模量 在23℃下为0.10〜50MPa。
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2.发明授权Adhesive sheet for a stealth dicing and a production method of a semiconductor wafer device 有权用于隐形切割的粘合片和半导体晶片装置的制造方法公开(公告)号：US08106522B2
公开(公告)日：2012-01-31
申请号：US12958446
申请日：2010-12-02
Applicant: Yosuke Sato , Masatomo Nakamura
Inventor： Yosuke Sato , Masatomo Nakamura
CPC classification number: C09J7/245 , C09J2201/622 , C09J2203/326 , C09J2427/006 , C09J2433/00 , Y10T428/265 , Y10T428/266 , Y10T428/28 , Y10T428/2852
Abstract: An adhesive sheet is provided enabling to efficiently produce the very small size semiconductor chip by a stealth dicing method. An adhesive sheet for a stealth dicing includes a substrate and an adhesive layer formed on one side of the substrate, wherein a Young's modulus of the adhesive sheet at 23° C. is 200 to 600 MPa, and a storage elastic modulus of the adhesive layer at 23° C. is 0.10 to 50 MPa.
Abstract translation: 提供了能够通过隐形切割方法有效地生产非常小尺寸的半导体芯片的粘合片。 用于隐形切割的粘合片包括基材和形成在基材的一侧上的粘合剂层，其中粘合片在23℃下的杨氏模量为200至600MPa，并且粘合剂层的储能弹性模量 在23℃下为0.10〜50MPa。
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