Semiconductor device and a method of manufacturing the same
    2.
    发明授权
    Semiconductor device and a method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US08258561B2

    公开(公告)日:2012-09-04

    申请号:US13307424

    申请日:2011-11-30

    IPC分类号: H01L27/08

    摘要: In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.

    摘要翻译: 关于包括电容器元件的半导体器件,提供了一种能够提高电容器元件的可靠性的技术。 电容器元件形成在半导体衬底上形成的元件隔离区域中。 电容器元件包括通过电容器绝缘膜形成在下电极上的下电极和上电极。 基本上,下电极和上电极由形成在多晶硅膜的表面上的多晶硅膜和硅化钴膜形成。 形成在上电极上的钴硅化物膜的端部与上电极的端部间隔开一定距离。 此外,形成在下电极上的钴硅化物膜的端部与上电极和下电极之间的边界间隔一定距离。

    SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20110008943A1

    公开(公告)日:2011-01-13

    申请号:US12885086

    申请日:2010-09-17

    IPC分类号: H01L21/8239

    摘要: The present invention provides a technology capable of reducing an area occupied by a nonvolatile memory while improving the reliability of the nonvolatile memory. In a semiconductor device, the structure of a code flash memory cell is differentiated from that of a data flash memory cell. More specifically, in the code flash memory cell, a memory gate electrode is formed only over the side surface on one side of a control gate electrode to improve a reading speed. In the data flash memory cell, on the other hand, a memory gate electrode is formed over the side surfaces on both sides of a control gate electrode. By using a multivalued memory cell instead of a binary memory cell, the resulting data flash memory cell can have improved reliability while preventing deterioration of retention properties and reduce its area.

    摘要翻译: 本发明提供一种能够在提高非易失性存储器的可靠性的同时减少由非易失性存储器占据的面积的技术。 在半导体器件中,代码闪存单元的结构与数据闪存单元的结构不同。 更具体地,在代码闪速存储单元中,仅在控制栅电极的一侧的侧面上形成存储栅电极,以提高读取速度。 另一方面,在数据闪存单元中,在控制栅电极的两侧的侧面上形成存储栅电极。 通过使用多值存储单元而不是二进制存储单元,所得到的数据闪存单元可以提高可靠性,同时防止保留性能的劣化并减小其面积。

    Semiconductor device and manufacturing method of semiconductor device
    6.
    发明授权
    Semiconductor device and manufacturing method of semiconductor device 有权
    半导体器件及半导体器件的制造方法

    公开(公告)号:US08969943B2

    公开(公告)日:2015-03-03

    申请号:US13302184

    申请日:2011-11-22

    摘要: A semiconductor device with a nonvolatile memory is provided which has improved characteristics. The semiconductor device includes a control gate electrode, a memory gate electrode disposed adjacent to the control gate electrode, a first insulating film, and a second insulating film including therein a charge storing portion. Among these components, the memory gate electrode is formed of a silicon film including a first silicon region positioned over the second insulating film, and a second silicon region positioned above the first silicon region. The second silicon region contains p-type impurities, and the concentration of p-type impurities of the first silicon region is lower than that of the p-type impurities of the second silicon region.

    摘要翻译: 提供了具有非易失性存储器的半导体器件,其具有改进的特性。 半导体器件包括控制栅极电极,与控制栅电极相邻设置的存储栅电极,第一绝缘膜和包括电荷存储部分的第二绝缘膜。 在这些部件中,存储栅电极由包括位于第二绝缘膜上的第一硅区的硅膜和位于第一硅区之上的第二硅区构成。 第二硅区域含有p型杂质,第一硅区域的p型杂质浓度低于第二硅区域的p型杂质浓度。

    SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME 失效
    半导体器件及其制造方法

    公开(公告)号:US20120068307A1

    公开(公告)日:2012-03-22

    申请号:US13307424

    申请日:2011-11-30

    IPC分类号: H01L27/08

    摘要: In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.

    摘要翻译: 关于包括电容器元件的半导体器件,提供了一种能够提高电容器元件的可靠性的技术。 电容器元件形成在半导体衬底上形成的元件隔离区域中。 电容器元件包括通过电容器绝缘膜形成在下电极上的下电极和上电极。 基本上,下电极和上电极由形成在多晶硅膜的表面上的多晶硅膜和硅化钴膜形成。 形成在上电极上的钴硅化物膜的端部与上电极的端部间隔开一定距离。 此外,形成在下电极上的钴硅化物膜的端部与上电极和下电极之间的边界间隔一定距离。