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    SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
    1.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE 审中-公开

    公开(公告)号：US20100283079A1

    公开(公告)日：2010-11-11

    申请号：US12837293

    申请日：2010-07-15

    申请人： Yong Seok CHOI ,  Kwang Cheol Lee

    发明人： Yong Seok CHOI ,  Kwang Cheol Lee

    IPC分类号： H01L33/58

    CPC分类号： H01L33/486 ,  H01L33/48 ,  H01L33/483 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor light emitting device package including a main body including a supporting member and an outside member on the supporting member; at least one semiconductor light emitting device disposed on the supporting member in which the outside member at least partially surrounds the at least one semiconductor light emitting device; first and second electrodes, at least one electrode of the first and second electrodes at least partially extending under the at least one semiconductor light emitting device; a metallic member disposed under the at least one semiconductor light emitting device and extending beyond outside edges of the at least one semiconductor light emitting device; a first molding part surrounded by the outside member and covering the at least one semiconductor light emitting device; and a second molding part disposed on the first molding part, the second molding part formed in a domed shape. Further, the first and second electrodes also extend to a bottom surface of the supporting member.

    Semiconductor light emitting device package
    2.
    发明授权
    Semiconductor light emitting device package 有权
    半导体发光器件封装

    公开(公告)号：US09166115B2

    公开(公告)日：2015-10-20

    申请号：US12837293

    申请日：2010-07-15

    申请人： Yong Seok Choi ,  Kwang Cheol Lee

    发明人： Yong Seok Choi ,  Kwang Cheol Lee

    IPC分类号： H01L33/00 ,  H01L33/48

    CPC分类号： H01L33/486 ,  H01L33/48 ,  H01L33/483 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor light emitting device package including a main body including a supporting member and an outside member on the supporting member; at least one semiconductor light emitting device disposed on the supporting member in which the outside member at least partially surrounds the at least one semiconductor light emitting device; first and second electrodes, at least one electrode of the first and second electrodes at least partially extending under the at least one semiconductor light emitting device; a metallic member disposed under the at least one semiconductor light emitting device and extending beyond outside edges of the at least one semiconductor light emitting device; a first molding part surrounded by the outside member and covering the at least one semiconductor light emitting device; and a second molding part disposed on the first molding part, the second molding part formed in a domed shape.

    摘要翻译： 一种半导体发光器件封装，包括在支撑构件上包括支撑构件和外部构件的主体; 至少一个半导体发光器件，其设置在所述支撑构件上，所述外部构件至少部分地围绕所述至少一个半导体发光器件; 第一和第二电极，第一和第二电极的至少一个电极至少部分地延伸到至少一个半导体发光器件的下方; 设置在所述至少一个半导体发光器件下方并延伸超过所述至少一个半导体发光器件的外边缘的金属部件; 由所述外部构件包围并覆盖所述至少一个半导体发光器件的第一成型部件; 以及设置在第一成型部上的第二成形部，第二成形部形成为圆顶状。

    Semiconductor light emitting device package
    3.
    发明授权
    Semiconductor light emitting device package 有权
    半导体发光器件封装

    公开(公告)号：US08158996B2

    公开(公告)日：2012-04-17

    申请号：US12443659

    申请日：2007-12-18

    申请人： Yong Seok Choi ,  Kwang Cheol Lee

    发明人： Yong Seok Choi ,  Kwang Cheol Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/48 ,  H01L33/483 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor light emitting device package according to an embodiment comprising: a package body comprising a groove section; an electrode in the groove section; at least one semiconductor light emitting device electrically connected to the electrode in the groove section of the package body; an interconnection pattern on an outer peripheral surface of the package body and electrically connected to the electrode, wherein a part of the interconnection pattern is on a bottom surface of the package body; and a metal pattern is on the bottom surface of the package body corresponding to an area in which the semiconductor light emitting device is located.

    摘要翻译： 根据实施例的半导体发光器件封装，包括：封装体，包括沟槽部分; 槽部中的电极; 至少一个半导体发光器件电连接到封装主体的沟槽部分中的电极; 在所述封装主体的外周表面上的电连接到所述电极的互连图案，其中所述互连图案的一部分在所述封装体的底表面上; 并且金属图案位于与半导体发光器件所在的区域对应的封装主体的底表面上。

    SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
    4.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE 有权
    半导体发光器件封装

    公开(公告)号：US20100012967A1

    公开(公告)日：2010-01-21

    申请号：US12443659

    申请日：2007-12-18

    申请人： Yong Seok Choi ,  Kwang Cheol Lee

    发明人： Yong Seok Choi ,  Kwang Cheol Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/48 ,  H01L33/483 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor light emitting device package according to an embodiment comprising: a package body comprising a groove section; an electrode in the groove section; at least one semiconductor light emitting device electrically connected to the electrode in the groove section of the package body; an interconnection pattern on an outer peripheral surface of the package body and electrically connected to the electrode, wherein a part of the interconnection pattern is on a bottom surface of the package body; and a metal pattern is on the bottom surface of the package body corresponding to an area in which the semiconductor light emitting device is located.

    摘要翻译： 根据实施例的半导体发光器件封装，包括：封装体，包括沟槽部分; 槽部中的电极; 至少一个半导体发光器件电连接到封装主体的沟槽部分中的电极; 在所述封装主体的外周表面上的电连接到所述电极的互连图案，其中所述互连图案的一部分在所述封装体的底表面上; 并且金属图案位于与半导体发光器件所在的区域对应的封装主体的底表面上。