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1.发明授权Process for producing modified epoxy resin, modified epoxy resin produced, and epoxy resin composition thereof 失效生产改性环氧树脂，改性环氧树脂的方法及其环氧树脂组合物
公开(公告)号：US5910548A
公开(公告)日：1999-06-08
申请号：US898021
申请日：1997-07-22
CPC分类号： C08G59/1455 , C08G59/066 , C08G59/4223
摘要： The process for producing a modified epoxy resin comprises reacting (a) an epoxy resin having at least two epoxy groups per one molecule, and (b) a specific active ester group-containing compound having at least two aromatic ring-bonded active ester groups per one molecule, in proportions such that the amount of the active ester groups in the active ester group-containing compound is from about 0.05 to about 0.95 mol per mole of the epoxy group in the epoxy resin, and the modified epoxy obtained by this process, and a composition of the epoxy resin and a curing agent are encompassed.
摘要翻译： 制备改性环氧树脂的方法包括：（a）每分子具有至少两个环氧基的环氧树脂和（b）每个具有至少两个芳香环键合的活性酯基的特定活性酯基化合物 一个分子，其比例使得含活性酯基化合物中的活性酯基的量为环氧树脂中每摩尔环氧基约0.05至约0.95mol，以及通过该方法获得的改性环氧树脂， 并且包括环氧树脂和固化剂的组合物。
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公开(公告)号：US5756564A
公开(公告)日：1998-05-26
申请号：US806883
申请日：1997-02-25
CPC分类号： H01L23/293 , C08L63/00 , H01B3/40 , H01L2924/0002
摘要： To provide an epoxy resin composition for encapsulation of semiconductors, which is superior in curability and can yield a cured product having low moisture absorption. The epoxy resin composition comprises the following components (a), (b), (c), and (d): (a) Epoxy resin (b) Epoxy resin hardener comprising a partially aromatic-esterified phenol aralkyl resin having a conversion of esterification of 10 to 90 mol % as the main component (c) Silica powder filler (d) Cure accelerator.
摘要翻译： 提供一种固化性优异的半导体封装用环氧树脂组合物，能够得到低吸湿性的固化物。 环氧树脂组合物包含以下组分（a），（b），（c）和（d）：（a）环氧树脂（b）包含具有酯化转化率的部分芳族酯化苯酚芳烷基树脂的环氧树脂固化剂 以10〜90mol％为主成分（c）二氧化硅粉末填料（d）固化促进剂。
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公开(公告)号：US5739186A
公开(公告)日：1998-04-14
申请号：US566574
申请日：1995-11-28
CPC分类号： C08G59/245 , C08G59/226 , C08G59/3218 , C08G59/38 , H01L23/293 , H01L2924/0002
摘要： The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.
摘要翻译： 本发明涉及一种用于半导体封装的环氧树脂组合物，其至少包括环氧树脂，硬化剂，无机填料和促进剂，其中所述环氧树脂是由约20至约90重量份的4,4'- 双酚F型环氧树脂和约10至约80重量份具有位于苯基核之间的极性极性烃基（Z）的多羟基酚醛环氧树脂或双酚型环氧树脂。
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公开(公告)号：US5872196A
公开(公告)日：1999-02-16
申请号：US590665
申请日：1996-01-24
CPC分类号： C08L63/00 , C08G59/4223
摘要： The present invention relates to a liquid resin composition comprising (1) a liquid epoxy resin, (2) a particular ester curing agent, and (3) a curing accelerator. This epoxy resin composition can provide a cured resin with excellent heat resistance and water resistance, which is particularly useful for encapsulation, casting and adhesion.
摘要翻译： 本发明涉及一种液体树脂组合物，其包含（1）液体环氧树脂，（2）特定的酯固化剂和（3）固化促进剂。 该环氧树脂组合物可以提供具有优异的耐热性和耐水性的固化树脂，其对于包封，浇铸和粘合特别有用。
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5.发明授权
公开(公告)号：US5597876A
公开(公告)日：1997-01-28
申请号：US625839
申请日：1996-04-01
CPC分类号： C08L63/00 , C08G59/245 , C08G59/621
摘要： An epoxy resin composition is provided comprising a biphenol-type epoxy resin and a polyhydric phenol resin curing agent derived from a polyhydric phenol compound having 2 or more phenolic hydroxyl groups attached at adjacent positions on the aromatic ring. A cured product with excellent stability and strength at high temperatures can be obtained useful as adhesives, castings, sealing materials, moldings, and laminates.
摘要翻译： 提供一种环氧树脂组合物，其包含双酚型环氧树脂和衍生自在芳环上的相邻位置处具有2个或更多个酚羟基的多元酚化合物的多元酚树脂固化剂。 可以获得在高温下具有优异稳定性和强度的固化产物，作为粘合剂，铸件，密封材料，模制品和层压材料。
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公开(公告)号：US5149730A
公开(公告)日：1992-09-22
申请号：US537316
申请日：1990-06-13
IPC分类号： H01L23/29 , C08G59/20 , C08G59/24 , C08G59/62 , C08L63/00 , C08L63/02 , H01B3/40 , H01L23/31
CPC分类号： H01B3/40 , C08G59/245 , C08L63/00
摘要： An electrical encapsulation formulation is provided comprising a diglycidyl ether of a 4,4'-dihydroxybiphenyl, a trisphenolic curing agent, a cure accelerator and an inorganic filler. The composition cures rapidly and exhibits excellent resistance to cracking under high-temperature operation.
摘要翻译： 提供了包含4,4'-二羟基联苯的二缩水甘油醚，三酚固化剂，固化促进剂和无机填料的电气封装配方。 该组合物快速固化并且在高温操作下表现出优异的抗开裂性。
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7.发明授权Halogenated epoxy resin, production of said resin, flame retardant, and flame-retarded epoxy resin composition 失效卤化环氧树脂，生产所述树脂，阻燃剂和阻燃环氧树脂组合物
公开(公告)号：US5750631A
公开(公告)日：1998-05-12
申请号：US672433
申请日：1996-06-28
IPC分类号： C07D303/24 , C08G59/06 , C08G59/08 , C08G59/30 , C08G59/32 , C08L63/00 , H01B3/44 , C08G8/28
CPC分类号： C08G59/3254 , C08G59/08 , C08G59/30 , C08G59/3218 , H01B3/44
摘要： The present invention relates to an epoxy composition represented by the formula (I) below, wherein G is a glycidyl group or a halogen atom. It is produced by reacting a halogenated polyhydric phenol compound with epihalohydrin in the presence of an alkali metal hydroxide. It is incorporated into a resin to render it flame retardant. ##STR1##
摘要翻译： 本发明涉及由下式（I）表示的环氧组合物，其中G是缩水甘油基或卤素原子。 它是通过在碱金属氢氧化物的存在下使卤代多元酚化合物与表卤代醇反应来制备的。 将其并入树脂中以使其具有阻燃性。 （一）
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公开(公告)号：US5141974A
公开(公告)日：1992-08-25
申请号：US537398
申请日：1990-06-13
IPC分类号： H01L23/29 , C08G59/14 , C08G59/20 , C08G59/24 , C08L63/00 , C08L63/02 , H01B3/40 , H01L23/31
CPC分类号： H01B3/40 , C08G59/245 , C08L63/00
摘要： A composition is disclosed which comprises the reaction product of a diglycidyl ether of a 4,4'-dihydroxybiphenyl and a polyhydric phenol having an average of 2.3 to 10 hydroxyl groups per molecule. The described epoxy resin is particularly useful in phenolic-cured electrical encapsulation formulations.
摘要翻译： 公开了一种组合物，其包含4,4'-二羟基联苯的二缩水甘油醚与每分子平均具有2.3至10个羟基的多元酚的反应产物。 所描述的环氧树脂在酚醛固化的电气封装配方中特别有用。
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公开(公告)号：US5185388A
公开(公告)日：1993-02-09
申请号：US884247
申请日：1992-05-11
CPC分类号： H01B3/40 , C08G59/3218 , C08L61/04 , C08L63/00
摘要： An electrical encapsulation composition is disclosed comprising (a) an epoxy resin which is the product of glycidating a polyphenolic compound which is the condensation product of (i) a substituted phenol which can be represented by the formula ##STR1## in which each R is selected independently from hydrogen, C.sub.1-5 alkyl and phenyl, with the provisos that at least two R groups are not hydrogen and that the R groups may be bonded in a ring structure, and (ii) an aromatic aldehyde or aromatic ketone having a phenolic hydroxyl group as represented by the general formula ##STR2## in which R' is selected from hydrogen, C.sub.1-5 alkyl and phenyl, R" is selected from C.sub.1-5 alkyl, phenyl, methoxy and halogen, and n is an integer from 0 to 4; (b) a curing agent for the epoxy resin; and (c) an inorganic filler.
摘要翻译： 公开了一种电气封装组合物，其包含（a）环氧树脂，其是将多酚化合物缩水化产物的产物，所述多酚化合物是（i）可以由其中每个R选择的式“IMAGE”表示的取代苯酚的缩合产物 独立于氢，C 1-5烷基和苯基，条件是至少两个R基团不是氢并且R基团可以键合在环结构中，和（ii）具有酚羟基的芳族醛或芳族酮 其中R'选自氢，C 1-5烷基和苯基，R“选自C 1-5烷基，苯基，甲氧基和卤素，n是0的整数。 到4; （b）环氧树脂的固化剂; 和（c）无机填料。
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公开(公告)号：US5623031A
公开(公告)日：1997-04-22
申请号：US585380
申请日：1996-01-11
IPC分类号： C08G59/06 , C08G59/12 , C08G59/14 , C08G59/16 , C08G59/24 , C08L63/00 , C08F283/00 , C08L61/00
CPC分类号： C08G59/1455 , C08G59/066 , C08G59/12 , C08G59/1444 , C08G59/245
摘要： A modified liquid epoxy resin composition is provided by reacting a crystalline epoxy resin, from about 3 to about 20 parts by weight, based on the epoxy resin, of a compound having two or more phenolic hydroxyl groups and/or carboxyl groups in one molecule and from about 3 to about 20 parts by weight of a compound having one phenolic hydroxyl group or carboxyl group in one molecule. The crystalline epoxy resin is preferably selected from various glycidylethers of biphenol compounds. The modified liquid epoxy resin composition has a low viscosity and good liquid stability at low temperatures, resulting in cured resins having excellent heat resistance and water resistance.
摘要翻译： 一种改性液体环氧树脂组合物是通过在一个分子中使基于环氧树脂的约3至约20重量份的结晶环氧树脂与在一个分子中具有两个或多个酚羟基和/或羧基的化合物反应， 约3至约20重量份在一个分子中具有一个酚羟基或羧基的化合物。 结晶环氧树脂优选选自联苯酚化合物的各种缩水甘油醚。 改性液体环氧树脂组合物在低温下具有低粘度和良好的液体稳定性，导致具有优异的耐热性和耐水性的固化树脂。
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