公开(公告)号：US11336045B2

公开(公告)日：2022-05-17

申请号：US17177833

申请日：2021-02-17

申请人： Yamaichi Electronics Co., Ltd.

发明人： Yoshiya Yamada ,  Koji Kikuchi ,  Toshiyasu Ito ,  Yosuke Takai

IPC分类号： H01R13/24 ,  H01R12/58 ,  H01R13/504 ,  H01R33/74 ,  H01R13/03 ,  H01R12/71

摘要： According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.