公开(公告)号：US20030027082A1

公开(公告)日：2003-02-06

申请号：US09838684

申请日：2001-04-19

Applicant: Xerox Corporation

Inventor： William S. Wong ,  Robert A. Street ,  Stephen D. White ,  Robert Matusiak ,  Raj B. Apte

IPC: G03F009/00 ,  B44C001/22 ,  C23F001/00 ,  C03C025/68 ,  G03C005/00 ,  C03C015/00

CPC classification number: G03F7/2018 ,  B41C1/025 ,  B41M3/006 ,  B41M5/0011 ,  G02F1/1303 ,  H01L27/1292

Abstract: A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

Abstract translation: 描述用于掩蔽待蚀刻表面的方法和系统。 液滴源喷射掩模材料的液滴以沉积在待蚀刻的薄膜或其它衬底表面上。 控制薄膜或基板表面的温度，使得液滴在与薄膜或基板表面接触时快速冷冻。 然后蚀刻薄膜或衬底。 蚀刻后，去除掩模材料。

公开(公告)号：US20020154187A1

公开(公告)日：2002-10-24

申请号：US09838685

申请日：2001-04-19

Applicant: Xerox Corporation

Inventor： William S. Wong ,  Robert A. Street ,  Stephen D. White ,  Robert Matusiak ,  Raj B. Apte

IPC: B41J029/38 ,  B41J002/135

CPC classification number: B41J2/14008 ,  H01L21/0271 ,  H01L21/0332 ,  H01L21/0337

Abstract: A method and system for masking a surface to be etched is described. A droplet source ejects droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze upon contact with the thin-film or substrate surface. The thin-film or substrate is then etched. After etching the masking material is removed.

Abstract translation: 描述用于掩蔽待蚀刻表面的方法和系统。 液滴源喷射掩模材料的液滴以沉积在待蚀刻的薄膜或其它衬底表面上。 控制薄膜或基板表面的温度，使得液滴在与薄膜或基板表面接触时快速冷冻。 然后蚀刻薄膜或衬底。 蚀刻后，去除掩模材料。