公开(公告)号：US20220102293A1

公开(公告)日：2022-03-31

申请号：US17037363

申请日：2020-09-29

Applicant: XILINX, INC.

Inventor： Chi Fung POON ,  Asma LARABA ,  Parag UPADHYAYA

IPC: H01L23/66 ,  H01L25/16 ,  H01L23/538

Abstract: Examples described herein generally relate to communication between integrated circuit (IC) dies in a wafer-level fan-out package. In an example, an electronic device includes a wafer-level fan-out package. The wafer-level fan-out package includes a first integrated circuit (IC) die, a second IC die, and a redistribution structure. The first IC die includes a transmitter circuit. The second IC die includes a receiver circuit. The redistribution structure includes physical channels electrically connected to and between the transmitter circuit and the receiver circuit. The transmitter circuit is configured to transmit multiple single-ended data signals and a differential clock signal through the physical channels to the receiver circuit. The receiver circuit is configured to capture data from the multiple single-ended data signals using a first single-ended clock signal based on the differential clock signal.