公开(公告)号：US4847114A

公开(公告)日：1989-07-11

申请号：US200861

申请日：1988-06-01

申请人： William R. Brasch ,  Carlo Favini

发明人： William R. Brasch ,  Carlo Favini

IPC分类号： H05K3/18 ,  H05K3/38 ,  H05K3/42

CPC分类号： H05K3/184 ,  H05K2203/0716 ,  H05K2203/122 ,  H05K2203/1415 ,  H05K3/381 ,  H05K3/427

摘要： The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.

摘要翻译： 用于制造已经通过聚合物抗蚀剂成像的印刷电路板的方法，其包括通过用具有高于非磁性材料上的电荷的电荷的催化剂处理成像电路板来选择性催化那些未被图像覆盖的区域， 并且足够低于抗蚀剂图像上的电荷以使催化剂从其上排斥，但足够接近非成像区域上的电荷以引起其上的催化剂的吸附。

公开(公告)号：US4761304A

公开(公告)日：1988-08-02

申请号：US17413

申请日：1987-02-24

申请人： William R. Brasch ,  Carlo Favini

发明人： William R. Brasch ,  Carlo Favini

IPC分类号： H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  B05D5/12

CPC分类号： H05K3/184 ,  H05K2203/0716 ,  H05K2203/122 ,  H05K2203/1415 ,  H05K3/381 ,  H05K3/427

摘要： The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.

公开(公告)号：US4759952A

公开(公告)日：1988-07-26

申请号：US898073

申请日：1986-08-20

申请人： William R. Brasch ,  Carlo Favini

发明人： William R. Brasch ,  Carlo Favini

IPC分类号： H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  B05D5/12

CPC分类号： H05K3/184 ,  H05K2203/0716 ,  H05K2203/122 ,  H05K2203/1415 ,  H05K3/381 ,  H05K3/427

摘要： The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.

摘要翻译： 用于制造已经通过聚合物抗蚀剂成像的印刷电路板的方法，其包括通过用具有高于非磁性材料上的电荷的电荷的催化剂处理成像电路板来选择性催化那些未被图像覆盖的区域， 并且足够低于抗蚀剂图像上的电荷以使催化剂从其上排斥，但足够接近非成像区域上的电荷以引起其上的催化剂的吸附。