公开(公告)号：US20250027586A1

公开(公告)日：2025-01-23

申请号：US18446426

申请日：2023-08-08

Applicant: William James Scott

Inventor： William James Scott

IPC: F16L19/02 ,  F16L15/04 ,  F16L19/06

Abstract: Systems and methods of the inventive subject matter are directed to components that are used to form lengths of conduit. Such a system can include a male component and a female component, where the male component has a male conical tapered surface on a threaded end and the female component comprises a female conical tapered surface on a threaded end. A B nut can be slid over the male component so a sleeve can be screwed onto the threaded end of the male component, and the B nut can then screw onto the threaded end of the female component, thereby pulling on the sleeve to bring the male component and the female component toward each other. Systems of the inventive subject matter are made from non-metal materials such as machinable ceramics, plastics, polymers, and the like.

公开(公告)号：US20220014222A1

公开(公告)日：2022-01-13

申请号：US17483492

申请日：2021-09-23

Applicant: William James Scott

Inventor： William James Scott

IPC: H04B1/3827 ,  A45C11/00

Abstract: Disclosed herein is an improved electronic device enclosure and methods for manufacturing the same. One embodiment includes a front panel; a back panel with a patterned intrusion region to improve passive audio amplification; an electrically conductive front plate; an electrically conductive back plate with an open region configured to permit transmission of radiofrequency signals; wherein the front plate couples with the front panel, the back plate couples with the back panel, the front panel hingedly couples with the back panel, and the front plate and back plate are configured to enclose an electronic device; and the front plate is sized and dimensioned to block radiofrequency radiation from exiting the front panel of the electronic device enclosure.

公开(公告)号：US20230243425A1

公开(公告)日：2023-08-03

申请号：US17588239

申请日：2022-01-29

Applicant: William James Scott

Inventor： William James Scott

IPC: F16J15/08

CPC classification number: F16J15/0806

Abstract: Embodiments of the inventive subject matter are directed to gaskets that can be used in various extreme settings including high temperature, vacuum, and high-pressure settings. Gaskets are made using soft annealed metals including aluminum, copper, nickel, and steel. Upon fully tightening a fitting using a gasket of the inventive subject matter, the gasket’s material is brought into a full hardness condition from its original soft annealed state. Ports that are designed for use with gaskets of the inventive subject matter is also disclosed. These ports include a first hole having a first diameter and then a second hole that continues from the first, where the second hole has a second, smaller diameter. Material transitions from the first diameter to the second diameter by a radial fillet. The filleted surface is configured to interact with a gasket of the inventive subject matter to minimize leak pathways. Performance of gaskets of the inventive subject matter can be further improved by applying a coating of, e.g., tin, silver, or gold.

公开(公告)号：US11146301B2

公开(公告)日：2021-10-12

申请号：US16408388

申请日：2019-05-09

Applicant: William James Scott

Inventor： William James Scott

IPC: H04M1/02 ,  H04B1/3827 ,  A45C11/00

Abstract: Disclosed herein is an improved electronic device enclosure and methods for manufacturing the same. One embodiment includes a front panel; a back panel with a patterned intrusion region to improve passive audio amplification; an electrically conductive front plate; an electrically conductive back plate with an open region configured to permit transmission of radiofrequency signals; wherein the front plate couples with the front panel, the back plate couples with the back panel, the front panel hingedly couples with the back panel, and the front plate and back plate are configured to enclose an electronic device; and the front plate is sized and dimensioned to block radiofrequency radiation from exiting the front panel of the electronic device enclosure.

公开(公告)号：US20250027593A1

公开(公告)日：2025-01-23

申请号：US18353716

申请日：2023-07-17

Applicant: William James Scott

Inventor： William James Scott

IPC: F16L58/18 ,  F16L19/025

Abstract: Systems and methods of the inventive subject matter are directed to components that are used to form lengths of conduit. Such a system can include a male component and a female component, where the male component has a male conical tapered surface on a threaded end and the female component comprises a female conical tapered surface on a threaded end. A B nut can be slid over the male component so a sleeve can be screwed onto the threaded end of the male component, and the B nut can then screw onto the threaded end of the female component, thereby pulling on the sleeve to bring the male component and the female component toward each other. Systems of the inventive subject matter are made from non-metal materials such as machinable ceramics, plastics, polymers, and the like.

公开(公告)号：US11901928B2

公开(公告)日：2024-02-13

申请号：US17483492

申请日：2021-09-23

Applicant: William James Scott

Inventor： William James Scott

IPC: H04B1/3827 ,  A45C11/00

CPC classification number: H04B1/3838 ,  A45C11/00 ,  A45C2011/002

Abstract: Disclosed herein is an improved electronic device enclosure and methods for manufacturing the same. One embodiment includes a front panel; a back panel with a patterned intrusion region to improve passive audio amplification; an electrically conductive front plate; an electrically conductive back plate with an open region configured to permit transmission of radiofrequency signals; wherein the front plate couples with the front panel, the back plate couples with the back panel, the front panel hingedly couples with the back panel, and the front plate and back plate are configured to enclose an electronic device; and the front plate is sized and dimensioned to block radiofrequency radiation from exiting the front panel of the electronic device enclosure.