Array substrate
    1.
    发明授权

    公开(公告)号:US12094888B2

    公开(公告)日:2024-09-17

    申请号:US17278722

    申请日:2021-02-05

    CPC classification number: H01L27/1244 H01L27/1222 H01L27/1288 H01L29/78675

    Abstract: An array substrate includes a substrate, a first metal layer and an active layer disposed on the substrate, an interlayer insulating layer, and a second metal layer. The first metal layer forms at least one first trace, the interlayer insulating layer is disposed on the first metal layer and the active layer, the second metal layer is disposed on the interlayer insulating layer, the interlayer insulating layer is formed with a first contact hole, and the second metal layer is connected to the first trace through the first contact hole. The first metal layer includes a conductive layer and a first protective layer stacked in sequence.

    Display panel
    2.
    发明授权

    公开(公告)号:US12087080B2

    公开(公告)日:2024-09-10

    申请号:US17419621

    申请日:2021-05-24

    Abstract: A display panel and a manufacturing method thereof are provided. A fingerprint recognition module and a storage capacitor of the display panel are disposed in a thin-film transistor (TFT) device layer. The fingerprint recognition module is electrically connected to an active layer and the storage capacitor of a TFT by an electrode layer, thereby optimizing a structure of an array substrate. Furthermore, the display panel can better receive reflected light signals and has improved fingerprint recognition performance. The display panel has a simple manufacturing process and low manufacturing costs.

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