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公开(公告)号：US20250098307A1
公开(公告)日：2025-03-20
申请号：US18567221
申请日：2023-09-26
Inventor： Haiming CAO , Chao TIAN , Shiyu LONG , Chunpeng ZHANG , Fei AI , Chungching HSIEH , Jianfeng YUAN
IPC: H01L27/12 , G02F1/1368 , H01L29/786
Abstract: An array substrate, a display panel, and a display device are provided. The array substrate includes a base; a buffer layer and a thin film transistor. The buffer layer is provided on the base and includes a first buffer layer and a second buffer layer. The first buffer layer is disposed between the second buffer layer and the base. A refractive index of the first buffer layer is greater than a refractive index of the base and a refractive index of the second buffer layer. A ratio of the refractive index of the first buffer layer to the refractive index of the base is less than or equal to 1.25. The thin film transistor is provided on a side of the buffer layer away from the base.
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公开(公告)号：US20240405003A1
公开(公告)日：2024-12-05
申请号：US18798719
申请日：2024-08-08
Inventor： Guowei ZHA , Jianfeng YUAN , Zhifu LI
IPC: H01L25/075 , G06V40/13
Abstract: The present application provides a display panel and a display device. The display panel includes a plurality of pixel units, wherein each of the pixel units includes a sub-pixel, the sub-pixel includes a first micro-LED chip, and in a top view, a gap is provided between adjacent ones of the first micro-LED chips; and a functional element disposed at the gap, wherein a function of the functional element is different from a display function of the sub-pixel, in order to improve integration of the display panel, increase an added value of the display panel, and save a space of the whole machine.
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公开(公告)号：US20240288620A1
公开(公告)日：2024-08-29
申请号：US18660360
申请日：2024-05-10
Inventor： Dong TIAN , Gege ZHOU , Wei ZHOU , Jianfeng YUAN , Zhifu LI
IPC: F21V8/00
CPC classification number: G02B6/0031
Abstract: A backlight module and a display panel are provided. The display panel includes a display panel main body and a backlight module. The backlight module includes a light guide, a first reflector, and a light source. By arranging the light source in a receiving cavity of the light guide, a width of a lamp socket of the backlight module is reduced, and a light effect of the lamp socket of the backlight module is improved.
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Patent Agency Ranking
公开(公告)号：US20220320050A1
公开(公告)日：2022-10-06
申请号：US16972638
申请日：2020-10-28
Inventor： Guowei ZHA , Jianfeng YUAN , Zhifu LI
IPC: H01L25/075 , G06V40/13
Abstract: The present application provides a display panel and a display device. The display panel includes a plurality of pixel units, wherein each of the pixel units includes a sub-pixel, the sub-pixel includes a first micro-LED chip, and in a top view, a gap is provided between adjacent ones of the first micro-LED chips; and a functional element disposed at the gap, wherein a function of the functional element is different from a display function of the sub-pixel, in order to improve integration of the display panel, increase an added value of the display panel, and save a space of the whole machine.
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公开(公告)号：US20220190185A1
公开(公告)日：2022-06-16
申请号：US17263943
申请日：2020-06-24
Inventor： Jianfeng YUAN , Fei AI , Jiyue SONG
IPC: H01L31/105 , H01L27/144 , H01L31/20 , H01L31/0336 , H01L51/42 , H01L27/30
Abstract: A positive-intrinsic-negative (PIN) photosensitive device is provided. A p-type semiconductor layer composed of molybdenum oxide and having valence band energy between valence band energy of an intrinsic semiconductor layer and an upper electrode is used to replace a p-type semiconductor layer used in a conventional PIN photodiode, so that the PIN photodiode may be prepared without using borane gas. More, a difference between valence band energy of the p-type semiconductor layer and the intrinsic semiconductor layer is used to transport holes located in a valence band, so that it is unnecessary to use an active layer of a thin film transistor, so that the PIN photosensitive device may be stacked on the thin film transistor to reduce aperture ratio loss of a display panel.
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公开(公告)号：US20230185009A1
公开(公告)日：2023-06-15
申请号：US17622477
申请日：2021-12-15
Inventor： Dong TIAN , Gege ZHOU , Wei ZHOU , Jianfeng YUAN , Zhifu LI
IPC: F21V8/00
CPC classification number: G02B6/0031
Abstract: A backlight module and a display panel are provided. The display panel includes a display panel main body and a backlight module. The backlight module includes a light guide, a first reflector, and a light source. By arranging the light source in a receiving cavity of the light guide, a width of a lamp socket of the backlight module is reduced, and a light effect of the lamp socket of the backlight module is improved.
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公开(公告)号：US20250089368A1
公开(公告)日：2025-03-13
申请号：US18567964
申请日：2023-09-26
Inventor： Huihui ZHAO , Chunpeng ZHANG , Fei AI , Jianfeng YUAN , Zhifu LI
IPC: H01L27/12 , H01L29/66 , H01L29/786
Abstract: A semiconductor device, a display panel, and a chip are provided in embodiments of the present application. The semiconductor device of the embodiments of the present application stacks a first conductor portion, a channel portion, and a second conductor portion to form a vertical active structure layer to realize a narrow channel. A growth direction of crystal grains arranged in the channel potion is consistent with a moving direction of carriers to provide a single crystal-like channel.
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公开(公告)号：US20210405422A1
公开(公告)日：2021-12-30
申请号：US16981959
申请日：2020-07-22
Inventor： Yantao LU , Zhifu LI , Jianfeng YUAN , Guanghui LIU , Chao WANG
IPC: G02F1/1345 , G02F1/1362 , H05K1/18
Abstract: A display panel and a display device are provided. The display panel includes an array substrate and a color filter substrate. A plurality of drive chips are arranged at intervals and sequentially connected in series in a stepped region of the array substrate. The drive chip includes an input pin and an output pin. The lower frame of the display screen may be reduced, and the screen occupancy ratio of the display screen may be increased by disposing the input pins of the drive chip on one edge of the drive chip, and disposing the flexible circuit board on at least one edge of two edges of the drive chip.
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