BACKLIGHT MODULE AND DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20250143059A1

    公开(公告)日:2025-05-01

    申请号:US18247635

    申请日:2023-03-24

    Inventor: Fu LI Yan CHENG

    Abstract: The disclosure discloses a backlight module and a display device including the same. The backlight module includes a substrate, a light source assembly disposed on the substrate and including a plurality of light-emitting chips disposed at intervals, and a light guide plate disposed on the light source assembly. A surface of the light guide plate facing the substrate is provided with a plurality of grooves where one of the light-emitting chips is correspondingly disposed in one of the grooves, a bottom of each of the grooves is provided with a plurality of first concave parts disposed at intervals, and each of the first concave parts is defined with an arc surface recessed towards a direction away from the substrate.

    CHIP-ON-FILM AND DISPLAY DEVICE
    2.
    发明公开

    公开(公告)号:US20240258226A1

    公开(公告)日:2024-08-01

    申请号:US18466278

    申请日:2023-09-13

    Inventor: Fu LI

    CPC classification number: H01L23/49838 H01L23/49811 H01L23/4985 H01L25/0753

    Abstract: A chip-on-film includes a flexible substrate, a plurality of negative polarity pins, and a positive polarity pin. The plurality of negative polarity pins are arranged in a row in a first direction on the flexible substrate, and two adjacent negative polarity pins of the plurality of negative polarity pins are arranged in an interval. The positive polarity pin is disposed on the flexible substrate. The positive polarity pin is at least partially located between two adjacent negative polarity pins of the plurality of negative polarity pins. The positive polarity pin includes a first extension portion and a second extension portion. The first extension portion intersects the second extension portion.

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