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公开(公告)号:US20250143059A1
公开(公告)日:2025-05-01
申请号:US18247635
申请日:2023-03-24
IPC: H10H29/856 , H01L25/075 , H10H29/80
Abstract: The disclosure discloses a backlight module and a display device including the same. The backlight module includes a substrate, a light source assembly disposed on the substrate and including a plurality of light-emitting chips disposed at intervals, and a light guide plate disposed on the light source assembly. A surface of the light guide plate facing the substrate is provided with a plurality of grooves where one of the light-emitting chips is correspondingly disposed in one of the grooves, a bottom of each of the grooves is provided with a plurality of first concave parts disposed at intervals, and each of the first concave parts is defined with an arc surface recessed towards a direction away from the substrate.
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公开(公告)号:US20240258226A1
公开(公告)日:2024-08-01
申请号:US18466278
申请日:2023-09-13
Inventor: Fu LI
IPC: H01L23/498
CPC classification number: H01L23/49838 , H01L23/49811 , H01L23/4985 , H01L25/0753
Abstract: A chip-on-film includes a flexible substrate, a plurality of negative polarity pins, and a positive polarity pin. The plurality of negative polarity pins are arranged in a row in a first direction on the flexible substrate, and two adjacent negative polarity pins of the plurality of negative polarity pins are arranged in an interval. The positive polarity pin is disposed on the flexible substrate. The positive polarity pin is at least partially located between two adjacent negative polarity pins of the plurality of negative polarity pins. The positive polarity pin includes a first extension portion and a second extension portion. The first extension portion intersects the second extension portion.
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