COOLING ARCHITECTURE FOR A CHASSIS WITH ORTHOGONAL CONNECTOR SYSTEM
    1.
    发明申请
    COOLING ARCHITECTURE FOR A CHASSIS WITH ORTHOGONAL CONNECTOR SYSTEM 审中-公开
    带有正交连接器系统的底盘冷却结构

    公开(公告)号:US20160174412A1

    公开(公告)日:2016-06-16

    申请号:US14572401

    申请日:2014-12-16

    CPC classification number: H05K7/20563 H05K7/20 H05K7/20536 H05K7/20554

    Abstract: An electronic equipment chassis assembly includes a housing, and a plurality of openings defined in the housing that allow airflow there-through. The openings include at least one intake opening defined in the front surface of the housing and at least one exit opening defined in the rear surface of the housing. The chassis also includes an air filter, and one or more rails disposed within the housing defining receiving slots that releasably secure a first plurality of circuit boards, and a second plurality of circuit boards, which second plurality of circuit boards are orthogonally oriented relative to the first plurality of circuit boards. The chassis includes an airflow assembly proximate the top surface of the housing, and one or more output fans proximate the rear surface of the housing. The airflow assembly and the output fans balance airflow throughout the chassis.

    Abstract translation: 电子设备底盘组件包括壳体和限定在壳体中的允许气流穿过的多个开口。 开口包括限定在壳体的前表面中的至少一个进气口和限定在壳体的后表面中的至少一个出口。 底盘还包括空气过滤器,并且设置在壳体内的一个或多个轨道限定了可释放地固定第一多个电路板的接收槽和第二多个电路板,第二组电路板相对于第二组电路板正交定向 第一组多个电路板。 底盘包括靠近壳体顶表面的气流组件和靠近壳体后表面的一个或多个输出风扇。 气流组件和输出风扇平衡机箱中的气流。

    Cooling architecture for a chassis with orthogonal connector system

    公开(公告)号:US10117358B2

    公开(公告)日:2018-10-30

    申请号:US14572401

    申请日:2014-12-16

    Abstract: An electronic equipment chassis assembly includes a housing, and a plurality of openings defined in the housing that allow airflow there-through. The openings include at least one intake opening defined in the front surface of the housing and at least one exit opening defined in the rear surface of the housing. The chassis also includes an air filter, and one or more rails disposed within the housing defining receiving slots that releasably secure a first plurality of circuit boards, and a second plurality of circuit boards, which second plurality of circuit boards are orthogonally oriented relative to the first plurality of circuit boards. The chassis includes an airflow assembly proximate the top surface of the housing, and one or more output fans proximate the rear surface of the housing. The airflow assembly and the output fans balance airflow throughout the chassis.

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