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公开(公告)号:US20240194975A1
公开(公告)日:2024-06-13
申请号:US18554317
申请日:2022-04-07
Applicant: VALEO SYSTEMES THERMIQUES
Inventor: Cedric DE VAULX , Kamel AZZOUZ , Jeremy BLANDIN , Yolanda BRAVO
IPC: H01M10/6557 , H01M10/613 , H01M10/615 , H01M10/625 , H01M10/653
CPC classification number: H01M10/6557 , H01M10/613 , H01M10/615 , H01M10/625 , H01M10/653 , H01M2220/20
Abstract: The present invention relates to an electronic system module that includes a plurality of electrical and/or electronic components, at least one temperature control element configured so as to adjust a temperature of at least one first electrical and/or electronic component and placed opposite a portion of the first electrical and/or electronic component, the temperature control element being placed between the first electrical and/or electronic component and a second electrical and/or electronic component adjacent to the first electrical and/or electronic component. The module includes at least one protective component in which the temperature control element is at least partially embedded, the protective component being at least partially in contact with the plurality of electrical and/or electronic components.
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公开(公告)号:US20240369304A1
公开(公告)日:2024-11-07
申请号:US18688411
申请日:2022-08-23
Applicant: VALEO SYSTEMES THERMIQUES
Inventor: Jeremy BLANDIN , Gael DURBECQ , Kamel AZZOUZ
Abstract: The present invention relates to a heat exchanger (1) comprising a heat exchange surface (3) with a plurality of tubes (4), each of the tubes (4) being configured to form part of a first refrigerant circuit or a second refrigerant circuit, characterized in that two refrigerant manifolds (5) are disposed at each of the longitudinal ends of the heat exchange surface (3) such that two of these refrigerant manifolds (5) are connected to the first refrigerant circuit and two other ones of these refrigerant manifolds (5) are connected to the second refrigerant circuit.
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公开(公告)号:US20240194974A1
公开(公告)日:2024-06-13
申请号:US18554063
申请日:2022-04-07
Applicant: VALEO SYSTEMES THERMIQUES
Inventor: Cedric DE VAULX , Kamel AZZOUZ , Jeremy BLANDIN , Yolanda BRAVO
IPC: H01M10/6557 , H01M10/625 , H01M10/643 , H01M10/6568
CPC classification number: H01M10/6557 , H01M10/625 , H01M10/643 , H01M10/6568
Abstract: The invention concerns a heat management device for at least one battery cell, including at least one rigid support part, a fluid recovery plate and a fluid distribution plate, the plates being arranged on either side of the rigid support part in a vertical direction of the rigid support part. The rigid support part includes at least one cavity for receiving the at least one battery cell and at least one channel formed parallel with the receiving cavity in the vertical direction and participating in forming a thermal regulation component.
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公开(公告)号:US20240375486A1
公开(公告)日:2024-11-14
申请号:US18688138
申请日:2022-07-29
Applicant: VALEO SYSTEMES THERMIQUES
Inventor: Gael DURBECQ , Jeremy BLANDIN , Kamel AZZOUZ
IPC: B60H1/32
Abstract: The present invention primarily relates to a heat exchanger including a heat-exchange surface intended to be traversed by an air flow including at least one four-way valve that is able to adopt a first position in which the four-way valve fluidically connects one of the inlet orifices of a first inlet manifold to an inlet line and one of the outlets of a second outlet manifold to an outlet line, and at least a second position in which the four-way valve fluidically connects one of the inlet orifices of the first inlet manifold to the outlet line and one of the outlets of the second outlet manifold to the inlet line.
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公开(公告)号:US20240194971A1
公开(公告)日:2024-06-13
申请号:US18554016
申请日:2022-04-07
Applicant: VALEO SYSTEMES THERMIQUES
Inventor: Cedric DE VAULX , Kamel AZZOUZ , Jeremy BLANDIN , Yolanda BRAVO
IPC: H01M10/653 , H01M50/213 , H01M50/224 , H01M50/289
CPC classification number: H01M10/653 , H01M50/213 , H01M50/224 , H01M50/289
Abstract: The invention relates to a heat management device (2) for at least one electrical and/or electronic component (4) for an electrical storage device (1), comprising at least one thermal regulation means (8), the heat management device (2) being characterized in that it further comprises a rigid supporting part (6) comprising at least one cavity (10) for receiving the at least one electrical and/or electronic component (4), the rigid supporting part (6) being made of a material with high thermal conductivity.
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