公开(公告)号：US09766725B2

公开(公告)日：2017-09-19

申请号：US14693567

申请日：2015-04-22

Applicant: UNEO Inc.

Inventor： Chih-Sheng Hou ,  Chia-Hung Chou

IPC: G06F3/0354

CPC classification number: G06F3/03545 ,  G01L1/16 ,  G01L1/18 ,  G06F3/0383

Abstract: A force sensing module is disclosed. One of the embodiments disclosed a first force sensor, and a second force sensor stacked on a top surface of the first force sensor; a signal processing circuit electrically coupled to the first signal force sensor and the second force sensor; when a force is applied on a top surface of the stack, a corresponding force signal is generated; wherein a strength of the force signal is related to an amount of the force applied against the stack.

公开(公告)号：US11609130B2

公开(公告)日：2023-03-21

申请号：US17152668

申请日：2021-01-19

Applicant: UNEO INC.

Inventor： Chih-Sheng Hou ,  Chia-Hung Chou

IPC: G01L1/16

Abstract: A cantilever force sensor with relatively lower On-Force is disclosed, which comprises a top stack, a bottom stack, and a spacer. The first spacer is configured between the top stack and the bottom stack and configured in a first side of the force sensor. A second side, opposite to the first side, of the top stack, is cantilevered from the bottom stack. When the force sensor is depressed from the top side, the second side of the top stack moves down using the first spacer as a fulcrum. Since the cantilevered side can be easily depressed down so that the On-Force for the force sensor is reduced and hence a force sensor with a relatively higher sensitivity is created.

公开(公告)号：US09762236B2

公开(公告)日：2017-09-12

申请号：US14611307

申请日：2015-02-02

Applicant: UNEO Inc.

Inventor： Cheng-Tsung Chen ,  Hsin-Lin Yu ,  Chih-Sheng Hou ,  Chia-Hung Chou

IPC: H01H57/00 ,  H03K17/96

CPC classification number: H03K17/964 ,  H01H2221/09

Abstract: An embedded button without having gap is disclosed according to the present invention. The button area just bends to operate instead of moving back and forth to operate within a through hole so that no water, vapor, or dust shall enter into the device. One of the embodiment comprises an inner bump configured on an inner side of an outer frame; a pressure switch is configured under the inner bump and touches the bottom surface of the bump; and an activating electrical signal is triggered when the button area is pressed by user with a force exceeding a threshold force level from outside surface of the outer frame of the electronic device.

公开(公告)号：US20230168138A1

公开(公告)日：2023-06-01

申请号：US18162719

申请日：2023-02-01

Applicant: UNEO INC.

Inventor： Chih-Sheng HOU ,  Chia-Hung Chou

IPC: G01L1/16

CPC classification number: G01L1/16

Abstract: A cantilever force sensor with relatively lower On-Force is disclosed, which comprises a top stack, a bottom stack, and a spacer. The first spacer is configured between the top stack and the bottom stack and configured in a first side of the force sensor. A second side, opposite to the first side, of the top stack, is cantilevered from the bottom stack. When the force sensor is depressed from the top side, the second side of the top stack moves down using the first spacer as a fulcrum. Since the cantilevered side can be easily depressed down so that the On-Force for the force sensor is reduced and hence a force sensor with a relatively higher sensitivity is created.

公开(公告)号：US09335840B1

公开(公告)日：2016-05-10

申请号：US14550230

申请日：2014-11-21

Applicant: UNEO INC.

Inventor： Chia-Hung Chou ,  Chih-Sheng Hou

IPC: G06F3/0354

CPC classification number: G06F3/03545 ,  G06F3/03546 ,  G06F3/0383

Abstract: A flexible circuit board based force sensor is disclosed. A flexible circuit having a first metal pad and a second metal pad, the flexible circuit board is folded so that the first metal pad functioning as a top metal pad and the bottom metal pad functioning as a bottom metal pad. A force sensing material is configured in between the top metal pad and the bottom metal pad to form a force sensor. An electronic drawing system adopts the flexible circuit board based force sensor in an electronic pen for sensing pressures applied against the pen tip of the electronic pen.

Abstract translation: 公开了一种基于柔性电路板的力传感器。 具有第一金属焊盘和第二金属焊盘的柔性电路，柔性电路板被折叠，使得第一金属焊盘用作顶部金属焊盘，底部金属焊盘用作底部金属焊盘。 力感测材料构造在顶部金属垫和底部金属垫之间以形成力传感器。 电子绘图系统在电子笔中采用基于柔性电路板的力传感器，用于感测施加在电子笔的笔尖上的压力。

公开(公告)号：US09686602B2

公开(公告)日：2017-06-20

申请号：US14739636

申请日：2015-06-15

Applicant: UNEO Inc.

Inventor： Chih-Sheng Hou ,  Cheng-Tsung Chen ,  Chia-Hung Chou

IPC: H04R1/10

CPC classification number: H04R1/1041 ,  H04R1/1008

Abstract: A green headphone is disclosed. A force sensor is configured between a speaker cover and a cushion of the headphone. The headphone switches on automatically to play audio when a user puts the headphone on his head. The headphone switches off automatically to stop playing audio when a user puts the headphone off his head, the power consumption is saved.

公开(公告)号：US09677954B2

公开(公告)日：2017-06-13

申请号：US14466667

申请日：2014-08-22

Applicant: UNEO INC.

Inventor： Chia-Hung Chou ,  Chih-Sheng Hou

IPC: G01L1/22 ,  G01L1/18 ,  G06F3/0354 ,  G01L5/00 ,  H01C10/12

CPC classification number: G01L1/18 ,  G01L5/0019 ,  G06F3/0338 ,  G06F3/03545 ,  H01C10/12

Abstract: An instant response pressure sensor is disclosed. An embodiment shows no continuous gap is configured between a piezoresistor and neighboring element(s) in thickness direction. The instant response pressure sensor is able to respond immediately to an extremely small pressure applied thereupon in the early stage with an extremely small distance movement because the instant response pressure sensor without having an extra press journey to move before trigging.