摘要:
The invention relates to a micro-structured fiber comprising a core region and a cladding region. The cladding region has a plurality of air holes regularly arranged on a plurality of rings, wherein the innermost ring of the fiber defines the core region. The cladding region comprises an inner circumference portion and an outer circumference portion; the inner circumference portion comprises at least one ring, the outer circumference portion comprises at least one ring, wherein the diameter of the air hole on the outer circumference portion is larger than that of the air hole on the inner circumference portion. As a result, the micro-structured fiber of the present invention has the advantages of broader band of nearly zero dispersion, less confinement loss, being easier to design due to less geometrical parameters needed to be optimized, and being easier to fabricate.
摘要:
The invention relates to a micro-structured fiber comprising a core region and a cladding region. The cladding region has a plurality of air holes regularly arranged on a plurality of rings, wherein the innermost ring of the fiber defines the core region. The cladding region comprises an inner circumference portion and an outer circumference portion; the inner circumference portion comprises at least one ring, the outer circumference portion comprises at least one ring, wherein the diameter of the air hole on the outer circumference portion is larger than that of the air hole on the inner circumference portion. As a result, the micro-structured fiber of the present invention has the advantages of broader band of nearly zero dispersion, less confinement loss, being easier to design due to less geometrical parameters needed to be optimized, and being easier to fabricate.
摘要:
This invention provides a digital electronic device comprising: a grounded metal portion comprising a first metal plate electrically connected to ground and a first substrate disposed on the first metal plate; at least one layer of differential-mode reference metal portion comprising a second substrate and a second metal plate electrically connected to the first metal plate by at least one conductive structure; a pair of differential signal lines at least partially disposed on the second substrate of the at least one layer of differential-mode reference metal portion and electromagnetically coupled to the second metal plate of the at least one layer of differential-mode reference metal portion; and an equalizer electrically connected to the pair of differential signal lines.
摘要:
A filtering device is capable of suppressing common mode noises upon transmission of a differential signal, and includes a differential transmission line, a grounding layer, a dielectric unit and a conductive structure. The differential transmission line has a pair of conductive traces spaced apart from each other. The grounding layer is spaced apart from the differential transmission line. The dielectric unit is disposed between the differential transmission line and the grounding layer. The conductive structure is embedded in the dielectric unit, is coupled electrically to the conductive traces and the grounding layer, and cooperates with the differential transmission line, the grounding layer and the dielectric unit to form a stacked structure that has an effective negative permittivity, thereby suppressing the common mode noises coupled to the conductive traces. A differential signal transmission circuit is also disclosed.
摘要:
Provided are common mode filtering method and device for use with a defected ground structure, the device including a substrate, coupled microstrip lines formed on the substrate and a ground plane formed underneath the substrate, the common mode filtering method being characterized by forming at least a defected ground structure on the ground plane and making dual mode signals pass through the coupled microstrip lines, thereby using the defected ground structure to suppress dual model noises within a specific frequency band and prevent signal distortion.
摘要:
Baluns with imaginary common-mode impedance are disclosed. A disclosed balun comprises an unbalanced port with an unbalanced terminal and a ground terminal, a balanced port with two balanced terminals opposite to each other in phase, and a transmission cell. The transmission cell has a differential transmission line, a virtually-ground patch, a ground conductor, and a conductive structure. The differential transmission line has a pair of conductive traces spaced apart from each other, and is electrically connected between the unbalanced port and the balanced port to transmit a differential signal. The virtually-ground patch is spaced apart from the differential transmission line. The conductive structure electrically connects the virtually-ground patch to the ground conductor.
摘要:
Proposed is an apparatus for silencing electromagnetic noise, characterized by a plurality of centrally symmetrical ring-shaped through-via-hole crystalline units provided between a high voltage plane and a low voltage plane at a regular interval, thereby forming an omnidirectional noise suppression frequency band for reducing noise interference and electromagnetic radiation. In a first embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between a metal plane and the low voltage plane. In a second embodiment of the ring-shaped through-via-hole crystalline units, the through via holes are perpendicularly coupled between two metal planes. Positioned at a regular interval, the through via holes enable provision of omnidirectional noise suppression frequency band, simplified design of a power plane, and reduction of production costs.
摘要:
A substrate for circuits is provided in this invention. The substrate includes a first voltage reference plane, a second voltage reference plane, a first dielectric layer, and a plurality of second dielectric materials embedded in the first dielectric layer. The first dielectric layer is between the first and second voltage reference planes. Each of the plurality of second dielectric materials includes a first end contacted with the first voltage reference plane and a second end contacted with the second voltage reference plane. The dielectric constant of the first dielectric layer is different from the dielectric constant of the second dielectric materials.
摘要:
The invention relates to a power plane system for suppressing ground bounce noise. The power plane system of the invention comprises a substrate, a power layer and a ground layer. The power layer comprises a plurality of metal units. There is a distance between two adjacent metal units. A plurality of bridges is used for connecting the metal units. The ground layer has a grounding metal plate. According to the invention, when the ground bounce noise occurs, the metal units can broaden the stop-band bandwidth. Therefore, the signals in the stop-band hardly are transmitted so as to suppress the ground bounce noise, and the high frequency ground bounce noise and the electromagnetic radiation can be suppressed efficiently.
摘要:
The invention relates to an embedded multi-layer circuit board and a noise suppression method. The embedded multi-layer circuit board comprises at least two ground layers, a power layer and a plurality of vias. The power layer is between two ground layers. Each via is electrically connected with the two ground layers and electrically isolated from the power layer. The power layer is divided to a plurality of periodical cells. Each cell comprises the same number of the vias.