公开(公告)号：US12143794B2

公开(公告)日：2024-11-12

申请号：US17945385

申请日：2022-09-15

Applicant: Transound Electronics Co., Ltd.

Inventor： Tseng-Feng Wen ,  Hui Xue

IPC: H04R9/02 ,  H04R9/04 ,  H04R9/06

Abstract: A loudspeaker using a semiconductor voice coil includes a vibrating assembly and a magnetic force assembly. The magnetic force assembly and the vibrating assembly are arranged at an interval. The vibrating component includes a diaphragm and the semiconductor voice coil. The semiconductor voice coil is arranged on a side of the diaphragm. The magnetic force assembly and the semiconductor voice coil are arranged on the same side of the diaphragm. A magnetic gap is defined in the magnetic force assembly. The semiconductor voice coil is arranged in the magnetic gap. The magnetic field lines in the magnetic gap are perpendicular to the direction of current in the semiconductor voice coil. An electronic device including the loudspeaker is also disclosed.

公开(公告)号：US20220150611A1

公开(公告)日：2022-05-12

申请号：US17153854

申请日：2021-01-20

Applicant: Transound Electronics Co., Ltd.

Inventor： Tseng-Feng Wen ,  Hui Xue

IPC: H04R1/02 ,  H04R9/06 ,  H04R9/04 ,  H04R9/02 ,  H04R7/12 ,  H04R7/18 ,  H04R1/34 ,  H04R3/00

Abstract: A one-piece speaker having a built-in sound cavity includes a holder, a casing, a diaphragm, a voice coil, a washer, a magnet, a U-shaped cup, and a circuit board assembly. The speaker has its built-in sound cavity, so that the assembly is more convenient and flexible. The overall structure is simpler and easy to be produced. The sound cavity is larger, the sound sensitivity is better, and there is no need to distinguish between mid and low sounds. The bandwidth is larger, the response speed is faster, the signal frequency allowed to pass is high, the signal distortion is small, and the sound quality is better.

公开(公告)号：USD1010610S1

公开(公告)日：2024-01-09

申请号：US29823729

申请日：2022-01-19

Applicant: Transound Electronics Co., Ltd.

Designer： Tseng-Feng Wen ,  Hu-Ming Zheng ,  Hui Xue ,  Hua-Quan Che

Abstract: FIG. 1 is a front perspective view of a headset showing our new design;
FIG. 2 is a rear perspective view of the headset in FIG. 1.
FIG. 3 is a front elevation view of the headset in FIG. 1.
FIG. 4 is a rear elevation view of the headset in FIG. 1.
FIG. 5 is a left side elevation view of the headset in FIG. 1.
FIG. 6 is a right side elevation view of the headset in FIG. 1.
FIG. 7 is a top plan view of the headset in FIG. 1; and,
FIG. 8 is a bottom plan view of the headset in FIG. 1.
The broken lines in the drawings are employed to show unclaimed portions of the headset, and form no part of the claimed design.

公开(公告)号：US20230097640A1

公开(公告)日：2023-03-30

申请号：US17695805

申请日：2022-03-15

Applicant: Transound Electronics Co., Ltd.

Inventor： Tseng-Feng Wen ,  Huming Zheng ,  Hui Xue

IPC: H04R9/06 ,  H04R7/06 ,  H04R7/18 ,  H04R9/02 ,  H04R1/02

Abstract: A speaker includes a speaker body and a diaphragm. The diaphragm is a planar structure. The speaker body includes a positioning structure. The positioning structure has a cavity penetrating front and back sides of the positioning structure. The diaphragm is positioned on the positioning structure. The diaphragm is in the form of a planar structure, instead of a curved or spherical structure. The planar structure of the diaphragm is simplified, so that the manufacturing process of the diaphragm is simpler.

公开(公告)号：US09462403B1

公开(公告)日：2016-10-04

申请号：US14887282

申请日：2015-10-19

Applicant: Transound Electronics Co., Ltd.

Inventor： Tseng-Feng Wen ,  Huming Zheng ,  Hui Xue ,  Sen Deng

IPC: H04R9/06 ,  H04R31/00 ,  H04R7/16 ,  H04R9/02 ,  H04R9/10

CPC classification number: H04R31/006 ,  H04R7/16 ,  H04R9/00 ,  H04R9/025 ,  H04R9/06 ,  H04R9/10 ,  H04R2207/021 ,  H04R2400/03 ,  H04R2400/07 ,  H04R2400/11 ,  H04R2499/11 ,  H04S7/00 ,  H04S2420/01

Abstract: A package-integrable high sound quality voice coil loudspeaker structure includes a metal shell, and a diaphragm, voice coil washer, magnet, T iron and PCB packed integrally inside the metal shell; the metal shell has a cylindrical side wall and bottom wall, and a sound output is opened on the bottom wall, with a lengthened cylinder in communication with the first sound output being projected outward integrally from the bottom face of the bottom wall. Therefore, the present invention utilizing the metal shell to pack all components integrally simplifies the assembly process, and has a good waterproof performance. In addition, the configuration of the lengthened cylinder improves the sound quality.

Abstract translation: 包装可整合的高音质音圈扬声器结构包括一个金属外壳，一个隔膜，音圈垫圈，磁铁，T铁和PCB，一体地装在金属外壳内; 金属壳体具有圆筒形侧壁和底壁，并且在底壁上打开声音输出，其中与第一声音输出连接的延长圆柱体从底壁的底面一体地向外突出。 因此，本发明利用金属外壳将所有部件整体地整体地简化组装过程，并且具有良好的防水性能。 此外，加长的气缸的结构提高了音质。

公开(公告)号：US11451892B2

公开(公告)日：2022-09-20

申请号：US17153854

申请日：2021-01-20

Applicant: Transound Electronics Co., Ltd.

Inventor： Tseng-Feng Wen ,  Hui Xue

IPC: H04R1/02 ,  H04R9/06 ,  H04R9/04 ,  H04R9/02 ,  H04R7/18 ,  H04R1/34 ,  H04R3/00 ,  H04R7/12

Abstract: A one-piece speaker having a built-in sound cavity includes a holder, a casing, a diaphragm, a voice coil, a washer, a magnet, a U-shaped cup, and a circuit board assembly. The speaker has its built-in sound cavity, so that the assembly is more convenient and flexible. The overall structure is simpler and easy to be produced. The sound cavity is larger, the sound sensitivity is better, and there is no need to distinguish between mid and low sounds. The bandwidth is larger, the response speed is faster, the signal frequency allowed to pass is high, the signal distortion is small, and the sound quality is better.

公开(公告)号：US20240155298A1

公开(公告)日：2024-05-09

申请号：US18139925

申请日：2023-04-26

Applicant: Transound Electronics Co., Ltd.

Inventor： Tseng-Feng Wen ,  Hui Xue ,  Yangfang Chen

IPC: H04R25/00

CPC classification number: H04R25/606 ,  H04R2460/13

Abstract: A bone conduction receiver includes a housing, a vibrating plate, a bracket, a magnetic loop assembly, a coil, and a protective cover. The vibrating plate is disposed inside the housing and keeps a distance from an inner bottom of the housing. The protective cover is located on one side of the vibrating plate, facing away from the inner bottom of the housing, and covers the opening of the accommodation room. The bracket is located on the side of the vibrating plate, facing away from the inner bottom of the housing. The magnetic loop assembly is secured in the bracket. One end of the coil is fixed to an inner side of the protective cover, and another end of the coil extends into the bracket and surrounds the magnetic loop assembly.

公开(公告)号：US11778388B2

公开(公告)日：2023-10-03

申请号：US17695805

申请日：2022-03-15

Applicant: Transound Electronics Co., Ltd.

Inventor： Tseng-Feng Wen ,  Huming Zheng ,  Hui Xue

IPC: H04R9/06 ,  H04R7/06 ,  H04R1/02 ,  H04R9/02 ,  H04R7/18

CPC classification number: H04R9/06 ,  H04R1/023 ,  H04R7/06 ,  H04R7/18 ,  H04R9/025

Abstract: A speaker includes a speaker body and a diaphragm. The diaphragm is a planar structure. The speaker body includes a positioning structure. The positioning structure has a cavity penetrating front and back sides of the positioning structure. The diaphragm is positioned on the positioning structure. The diaphragm is in the form of a planar structure, instead of a curved or spherical structure. The planar structure of the diaphragm is simplified, so that the manufacturing process of the diaphragm is simpler.