公开(公告)号：US20040218340A1

公开(公告)日：2004-11-04

申请号：US10857068

申请日：2004-05-28

申请人： Toto, Ltd. ,  Ulvac, Inc.

发明人： Tetsuo Kitabayashi ,  Hiroaki Hori ,  Takeshi Uchimura ,  Noriaki Tateno ,  Koh Fuwa ,  Ken Maehara

IPC分类号： H01H001/00

CPC分类号： B23Q3/15 ,  B23Q3/154 ,  H01L21/6833 ,  H02N13/00

摘要： An electrostatic chuck for attracting an insulative substrate to be processed, the electrostatic chuck comprising a dielectric layer having a first surface which attracts an insulative substrate, and a second surface on which are provided a plurality of electrodes, and an insulative support base plate fixing said dielectric layer. A distance between adjacent ones of the electrodes and the thickness of the dielectric layer are adjusted such that when a potential difference is established between the electrodes, a non-uniform electric field is formed in which the insulative substrate is partially polarized and attracted to the first surface by gradient force.