Self-aligned ITO gate electrode for GaN HEMT device
    1.
    发明授权
    Self-aligned ITO gate electrode for GaN HEMT device 有权
    用于GaN HEMT器件的自对准ITO栅电极

    公开(公告)号:US09385001B1

    公开(公告)日:2016-07-05

    申请号:US14660281

    申请日:2015-03-17

    摘要: A P-N junction gate high electron mobility transistor (HEMT) device with a self-aligned gate structure and a method for making the HEMT device is disclosed. In one embodiment, the HEMT device includes a heterojunction comprising a barrier layer formed on a channel layer. A gate layer is formed on the barrier layer, the gate layer comprising a P-type group III-V semiconductor material suitable for depleting the carriers of a current conducting channel at the heterojunction when the HEMT device is off. A gate electrode comprising indium tin oxide (ITO) is formed on the gate layer, the gate electrode and the gate layer having substantially the same length.

    摘要翻译: 公开了具有自对准栅极结构的P-N结栅极高电子迁移率晶体管(HEMT)器件和制造HEMT器件的方法。 在一个实施例中,HEMT装置包括异质结,其包括形成在通道层上的阻挡层。 栅极层形成在阻挡层上,栅极层包括适于在HEMT器件断开时在异质结上消耗导电沟道的载流子的P型III-V族半导体材料。 在栅极层上形成包括氧化铟锡(ITO)的栅电极,栅极电极和栅极层具有基本相同的长度。