公开(公告)号：US20250006541A1

公开(公告)日：2025-01-02

申请号：US18754701

申请日：2024-06-26

Applicant: Tokyo Electron Limited

Inventor： Riichiro ENDO ,  Takehiro TANIKAWA ,  Kazuma KITA

IPC: H01L21/683 ,  H01J37/32 ,  H01L21/67

Abstract: A substrate-processing apparatus includes a substrate support that includes an electrostatic chuck, the electrostatic chuck including a support surface configured to support an annular member. The support surface includes a diffusion groove through which a heat transfer gas is diffused into a gap between the annular member and the support surface. The diffusion groove includes an annular groove provided concentrically with the electrostatic chuck; and a radial groove that is in communication with the annular groove and is provided from the annular groove in a radial direction of the electrostatic chuck.