公开(公告)号：US20240363310A1

公开(公告)日：2024-10-31

申请号：US18308877

申请日：2023-04-28

Applicant: Tokyo Electron Limited

Inventor： Qiang Wang ,  Michael Hummel ,  Peter Lowell George Ventzek ,  Shyam Sridhar ,  Mitsunori Ohata

IPC: H01J37/32 ,  H01Q5/10

CPC classification number: H01J37/32183 ,  H01J37/32091 ,  H01Q5/10

Abstract: According to an embodiment, a plasma processing system includes a plasma chamber, an RF source, a matching circuit, a balun, and a resonating antenna. The resonating antenna includes a first and a second spiral resonant antenna (SRA), each having an electrical length corresponding to a quarter of a wavelength of a frequency of a forward RF wave generated by the RF source. The first end of the first SRA is coupled to a first balanced terminal of the balun and the second end of the first SRA is open circuit. The first end of the second SRA is coupled to a second balanced terminal of the balun and the second end of the second SRA is open circuit. The first and the second SRA are arranged in a symmetrically nested configuration having a same center point.

公开(公告)号：US20240347317A1

公开(公告)日：2024-10-17

申请号：US18298829

申请日：2023-04-11

Applicant: Tokyo Electron Limited

Inventor： Qiang Wang ,  Michael Hummel ,  Peter Lowell George Ventzek ,  Alok Ranjan ,  Mitsunori Ohata

IPC: H01J37/32

CPC classification number: H01J37/3211 ,  H01J37/32146 ,  H01J37/32183 ,  H01J2237/24564

Abstract: A resonator antenna system for a plasma processing tool includes a resonator antenna coupled to a RF source at a first point on the resonator antenna, a current balancing circuit coupled to the resonator antenna at a second point on the resonator antenna, a first current sensor coupled between the RF source and the resonator antenna, and a second current sensor coupled between the current balancing circuit and the resonator antenna. The current balancing circuit includes a variable component. The current balancing circuit is further coupled to a ground terminal.

公开(公告)号：US20240339297A1

公开(公告)日：2024-10-10

申请号：US18296944

申请日：2023-04-06

Applicant: Tokyo Electron Limited

Inventor： Qiang Wang ,  Peter Lowell George Ventzek ,  Shyam Sridhar ,  Mitsunori Ohata

IPC: H01J37/32 ,  H03H7/38

CPC classification number: H01J37/32183 ,  H01J37/32091 ,  H01J37/3211 ,  H03H7/38 ,  H01J37/32155 ,  H01J2237/24564 ,  H01J2237/334

Abstract: An embodiment matching circuit for a plasma tool includes an impedance matching network configured to be coupled between a power supply and an antenna of a plasma chamber. The power supply is configured to provide power to and excite the antenna at a first frequency to generate a plasma. The impedance matching network is configured such that, during operation of the plasma chamber at the first frequency, a phase angle between a voltage and a current in the impedance matching network is matched to be 0°, and an impedance of the impedance matching network and the plasma chamber equals an impedance of the power supply. The impedance matching network includes a first adjustable reactive component; and a first fixed-length transmission line coupled between the first adjustable reactive component and an input of the antenna.

公开(公告)号：US20240377331A1

公开(公告)日：2024-11-14

申请号：US18313958

申请日：2023-05-08

Applicant: Tokyo Electron Limited

Inventor： Qiang Wang ,  Zhiying Chen ,  Peter Lowell George Ventzek

IPC: G01N21/73 ,  G01J3/443 ,  H01J37/32

Abstract: A method of characterizing a plasma in a plasma processing chamber that includes: sustaining a plasma generated from a process gas in a plasma processing chamber; flowing a probe gas through the plasma processing chamber; obtaining spatially-resolved OES signals at a wavelength of an optical emission line of the probe gas within the plasma processing chamber, signal intensities of the spatially-resolved OES signals being correlated to a plasma parameter of the plasma, the plasma parameter having a spatial distribution within the plasma processing chamber; and based on the spatially-resolved OES signals, constructing a 3D map of OES signals by data fitting of the spatially-resolved OES signals with a computation model; and converting the 3D map of OES signals into a 3D map of the plasma parameter, the 3D map of the plasma parameter including information about the spatial distribution.