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公开(公告)号：US20200211865A1
公开(公告)日：2020-07-02
申请号：US16727007
申请日：2019-12-26
发明人： Takahiko Otsu , Kazuya Koyama , Takao Inada
摘要： A substrate processing apparatus includes: a processing tank that stores a processing liquid for performing a liquid processing on a plurality of substrates; a substrate support that supports the plurality of substrates such that main surfaces of each of the plurality of substrates follow a vertical direction in the processing tank; a processing liquid ejection unit provided below the plurality of substrates supported by the substrate support, and generates an ascending flow of the processing liquid in the processing tank; and a rectifying section that adjusts flow of the processing liquid in a side space formed between a first side wall of the processing tank and a first substrate having a main surface facing the first side wall of the processing tank among the plurality of substrates.
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公开(公告)号：US11476130B2
公开(公告)日：2022-10-18
申请号：US16805898
申请日：2020-03-02
IPC分类号： H01L21/67 , H01L21/687 , B05B1/00 , B05B13/02
摘要： A substrate processing apparatus includes a liquid processing tank, a movement mechanism, an ejector, and a controller. The liquid processing tank stores a processing liquid. The movement mechanism moves a plurality of substrates immersed in the liquid processing tank to a position above the liquid surface of the processing liquid. The ejector ejects a vapor of an organic solvent toward portions of the plurality of substrates that are exposed from the liquid surface. The controller changes an ejection flow rate of the vapor ejected by the ejector as the plurality of substrates are moved up.
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公开(公告)号：US20200286754A1
公开(公告)日：2020-09-10
申请号：US16805898
申请日：2020-03-02
IPC分类号： H01L21/67 , H01L21/687 , B05B13/02 , B05B1/00
摘要： A substrate processing apparatus includes a liquid processing tank, a movement mechanism, an ejector, and a controller. The liquid processing tank stores a processing liquid. The movement mechanism moves a plurality of substrates immersed in the liquid processing tank to a position above the liquid surface of the processing liquid. The ejector ejects a vapor of an organic solvent toward portions of the plurality of substrates that are exposed from the liquid surface. The controller changes an ejection flow rate of the vapor ejected by the ejector as the plurality of substrates are moved up.
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公开(公告)号：US10998198B2
公开(公告)日：2021-05-04
申请号：US16232645
申请日：2018-12-26
发明人： Kazuya Koyama
IPC分类号： H01L21/311 , H01L21/67
摘要： There is provided a substrate processing method for performing an etching processing by immersing a substrate in a processing liquid containing a chemical liquid and silicon, the substrate processing method including: a preparation step of setting a supply flow rate of the chemical liquid based on a replenishment amount of the chemical liquid and a replenishment amount of the silicon; and a replenishment step of supplying the chemical liquid at the set supply flow rate of the chemical liquid and dissolving a set replenishment amount of the silicon in the processing liquid.
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公开(公告)号：US11087992B2
公开(公告)日：2021-08-10
申请号：US16778267
申请日：2020-01-31
IPC分类号： H01L21/311 , H01L21/3213 , H01L21/306 , B08B3/08 , H01L21/67 , H01L21/02
摘要： An etching method includes a first etching step, a processing step, and a second etching step. The first etching step is performed to etch a substrate on which a silicon oxide film and a silicon nitride film are formed with an etching liquid. The processing step is performed to process a pattern in the silicon oxide film on the substrate with a pattern shape processing liquid after the first etching step. The second etching step is performed to etch the substrate with the etching liquid after the processing step.
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公开(公告)号：US20200286751A1
公开(公告)日：2020-09-10
申请号：US16804056
申请日：2020-02-28
发明人： Kazuya Koyama , Kotaro Tsurusaki , Koji Yamashita
IPC分类号： H01L21/67 , H01L21/687
摘要： A substrate processing apparatus includes a liquid processing tank, a movement mechanism, an ejector, and a controller. The liquid processing tank stores a processing liquid. The movement mechanism moves a plurality of substrates immersed in the liquid processing tank to above the liquid surface of the processing liquid. The ejector ejects a vapor of an organic solvent toward portions of the plurality of substrates exposed from the liquid surfaces. The controller moves up the ejection position of the vapor of the organic solvent by the ejection unit as the plurality of substrates are moved up.
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公开(公告)号：US20210335621A1
公开(公告)日：2021-10-28
申请号：US17367975
申请日：2021-07-06
IPC分类号： H01L21/311 , B08B3/08 , H01L21/67 , H01L21/02 , H01L21/3213 , H01L21/306
摘要： An etching method includes a first etching step, a processing step, and a second etching step. The first etching step is performed to etch a substrate on which a silicon oxide film and a silicon nitride film are formed with an etching liquid. The processing step is performed to process a pattern in the silicon oxide film on the substrate with a pattern shape processing liquid after the first etching step. The second etching step is performed to etch the substrate with the etching liquid after the processing step.
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公开(公告)号：US20200251343A1
公开(公告)日：2020-08-06
申请号：US16778267
申请日：2020-01-31
IPC分类号： H01L21/311 , B08B3/08 , H01L21/02 , H01L21/67
摘要： An etching method includes a first etching step, a processing step, and a second etching step. The first etching step is performed to etch a substrate on which a silicon oxide film and a silicon nitride film are formed with an etching liquid. The processing step is performed to process a pattern in the silicon oxide film on the substrate with a pattern shape processing liquid after the first etching step. The second etching step is performed to etch the substrate with the etching liquid after the processing step.
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公开(公告)号：US10037901B2
公开(公告)日：2018-07-31
申请号：US14713275
申请日：2015-05-15
发明人： Kazuya Koyama , Hiromi Kiyose , Katsufumi Matsuki , Shuhei Takahashi , Hideki Nishimura , Takashi Uno , Hirotaka Maruyama
CPC分类号： H01L21/67017 , B08B9/032 , H01L21/67023
摘要： A substrate liquid treatment apparatus includes: at least one processing unit that processes a substrate with a treatment liquid; a storage tank that stores the treatment liquid; a circulation line through which the treatment liquid discharged from the storage tank into the circulation line is returned to the storage tank; a branch supply line that is branched from the circulation line to supply the treatment liquid to the processing unit; a recovery line that returns to the storage tank the treatment liquid having been supplied to the substrate in the processing unit; a distribution line connecting the circulation line and the recovery line; and a shutoff valve, provided on the distribution line, that is opened when cleaning of the recovery line is performed.
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公开(公告)号：US20140373877A1
公开(公告)日：2014-12-25
申请号：US14297723
申请日：2014-06-06
发明人： Shigehisa Inoue , Daisuke Nakayama , Katsufumi Matsuki , Takuro Masuzumi , Yuki Yoshida , Meitoku Aibara , Hiromi Kiyose , Takashi Uno , Hirotaka Maruyama , Kazuya Koyama , Takashi Nakazawa
CPC分类号： B08B3/02 , H01L21/67051
摘要： Disclosed are a liquid processing apparatus and a liquid processing method in which a substrate is processed by a processing liquid in the form of liquid droplets. The liquid processing apparatus includes: a first processing liquid ejecting unit configured to eject a first processing liquid in a form of liquid droplets which contains pure water toward the surface of the substrate; and a second processing liquid ejecting unit configured to eject a second processing liquid as a continuous liquid stream toward the surface of the substrate processed by the first processing liquid in the form of the liquid droplets. The second processing liquid inverts a zeta potential on the surface of the substrate into a negative zeta potential.
摘要翻译： 公开了一种液体处理装置和液体处理方法，其中基板由液滴形式的处理液体处理。 液体处理装置包括：第一处理液体喷射单元，被配置为将含有纯水的液滴形式的第一处理液喷射到基板的表面; 以及第二处理液体喷射单元，被配置为以液滴的形式将作为连续液体流的第二处理液体朝向由第一处理液体处理的基板的表面喷射。 第二处理液将基板表面上的ζ电位反转为负ζ电位。
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