SUBSTRATE LIQUID PROCESSING APPARATUS
    1.
    发明申请

    公开(公告)号:US20200211865A1

    公开(公告)日:2020-07-02

    申请号:US16727007

    申请日:2019-12-26

    IPC分类号: H01L21/67 B05B12/14

    摘要: A substrate processing apparatus includes: a processing tank that stores a processing liquid for performing a liquid processing on a plurality of substrates; a substrate support that supports the plurality of substrates such that main surfaces of each of the plurality of substrates follow a vertical direction in the processing tank; a processing liquid ejection unit provided below the plurality of substrates supported by the substrate support, and generates an ascending flow of the processing liquid in the processing tank; and a rectifying section that adjusts flow of the processing liquid in a side space formed between a first side wall of the processing tank and a first substrate having a main surface facing the first side wall of the processing tank among the plurality of substrates.

    Substrate processing method and substrate processing apparatus

    公开(公告)号:US10998198B2

    公开(公告)日:2021-05-04

    申请号:US16232645

    申请日:2018-12-26

    发明人: Kazuya Koyama

    IPC分类号: H01L21/311 H01L21/67

    摘要: There is provided a substrate processing method for performing an etching processing by immersing a substrate in a processing liquid containing a chemical liquid and silicon, the substrate processing method including: a preparation step of setting a supply flow rate of the chemical liquid based on a replenishment amount of the chemical liquid and a replenishment amount of the silicon; and a replenishment step of supplying the chemical liquid at the set supply flow rate of the chemical liquid and dissolving a set replenishment amount of the silicon in the processing liquid.

    SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM

    公开(公告)号:US20200286751A1

    公开(公告)日:2020-09-10

    申请号:US16804056

    申请日:2020-02-28

    IPC分类号: H01L21/67 H01L21/687

    摘要: A substrate processing apparatus includes a liquid processing tank, a movement mechanism, an ejector, and a controller. The liquid processing tank stores a processing liquid. The movement mechanism moves a plurality of substrates immersed in the liquid processing tank to above the liquid surface of the processing liquid. The ejector ejects a vapor of an organic solvent toward portions of the plurality of substrates exposed from the liquid surfaces. The controller moves up the ejection position of the vapor of the organic solvent by the ejection unit as the plurality of substrates are moved up.

    LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD
    10.
    发明申请
    LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD 审中-公开
    液体加工设备和液体加工方法

    公开(公告)号:US20140373877A1

    公开(公告)日:2014-12-25

    申请号:US14297723

    申请日:2014-06-06

    IPC分类号: B08B3/02 H01L21/67

    CPC分类号: B08B3/02 H01L21/67051

    摘要: Disclosed are a liquid processing apparatus and a liquid processing method in which a substrate is processed by a processing liquid in the form of liquid droplets. The liquid processing apparatus includes: a first processing liquid ejecting unit configured to eject a first processing liquid in a form of liquid droplets which contains pure water toward the surface of the substrate; and a second processing liquid ejecting unit configured to eject a second processing liquid as a continuous liquid stream toward the surface of the substrate processed by the first processing liquid in the form of the liquid droplets. The second processing liquid inverts a zeta potential on the surface of the substrate into a negative zeta potential.

    摘要翻译: 公开了一种液体处理装置和液体处理方法,其中基板由液滴形式的处理液体处理。 液体处理装置包括:第一处理液体喷射单元,被配置为将含有纯水的液滴形式的第一处理液喷射到基板的表面; 以及第二处理液体喷射单元,被配置为以液滴的形式将作为连续液体流的第二处理液体朝向由第一处理液体处理的基板的表面喷射。 第二处理液将基板表面上的ζ电位反转为负ζ电位。