公开(公告)号：US20240120867A1

公开(公告)日：2024-04-11

申请号：US18480575

申请日：2023-10-04

Applicant: Tokyo Electron Limited

Inventor： Youichi MASAKI ,  Mitsuteru YANO ,  Eiichi SEKIMOTO ,  Tsuyoshi OTSUKA ,  Akihiro TERAMOTO ,  Teppei ITO ,  Koji TAKAYANAGI

IPC: H02P21/20 ,  H02P21/22

CPC classification number: H02P21/20 ,  H02P21/22 ,  H02P2205/05

Abstract: A motor control method for transferring an object to be transferred by a moving object that moves by driving of a motor in a substrate processing apparatus, includes: a data acquisition process of acquiring, at different times, pieces of drive data which relate to the driving of the motor and vary with heat generation of the motor; and a transfer process of transferring the object to be transferred by controlling current to be supplied to the motor, based on each of the pieces of drive data, to compensate for displacement of the object to be transferred from a target transfer position due to the heat generation of the motor.

公开(公告)号：US20180182611A1

公开(公告)日：2018-06-28

申请号：US15823843

申请日：2017-11-28

Applicant: Tokyo Electron Limited

Inventor： Eiichi SEKIMOTO ,  Takeshi SAIKUSA ,  Hiroshi SEKO

IPC: H01L21/027 ,  G03F7/20 ,  H01L21/67

CPC classification number: H01L21/027 ,  G03F7/202 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67225 ,  H01L21/67248

Abstract: A thermal treatment apparatus including a hot plate which heats a substrate mounted thereon, in a treatment chamber including a lid body covering a surface to be treated of the substrate mounted on the hot plate, the thermal treatment apparatus includes: a control unit which controls at least a temperature of the hot plate, and a temperature measuring unit which measures a temperature of the lid body, wherein the control unit is configured to perform, when a set temperature of the hot plate is changed, correction of a heating amount by the hot plate for obtaining the set temperature after change, based on the temperature of the lid body measured by the temperature measuring unit.

公开(公告)号：US20170170040A1

公开(公告)日：2017-06-15

申请号：US15378595

申请日：2016-12-14

Applicant: Tokyo Electron Limited

Inventor： Kenichi SHIGETOMI ,  Takeshi SAIKUSA ,  Eiichi SEKIMOTO ,  Takayuki FUKUDOME ,  Kousuke YOSHIHARA ,  Suguru ENOKIDA ,  Kazuhiro TAKESHITA ,  Kazuto UMEKI

IPC: H01L21/67

CPC classification number: H01L21/67248 ,  H01L21/67103 ,  H05B1/0233 ,  H05B2203/037

Abstract: A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.