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公开(公告)号:US20180272476A1
公开(公告)日:2018-09-27
申请号:US15762094
申请日:2016-09-23
Applicant: Tianjin University
Inventor: Lianyong XU , Yongdian HAN , Hongyang JING , Lel ZHAO , Xiaoqing LV
CPC classification number: B23K35/262 , B22F1/0011 , B22F9/04 , B22F2009/043 , B22F2201/11 , B22F2201/20 , B22F2301/30 , B22F2304/10 , B22F2998/10 , B22F2999/00 , B23K35/0244 , B23K35/26 , B23K35/3601 , B23K35/40 , C22C13/00 , C22C47/14 , C22C49/02 , C22C49/14 , C22C1/05 , B22F3/02 , B22F3/10
Abstract: This invention discloses a method for preparing a kind of Sn-based silver-graphene lead-free composite solder, including mixing a certain amount of graphene with sodium dodecyl sulfate, then adding a certain amount of dimethylformamide, sonicating for 2 hours, adding a certain amount of silver nitrate to the mixture, continuing the sonication and finally obtaining the homemade. The solders matrix powder is weighed according to different silver-graphene mass fraction required, then poured into a ball-milling tank milling for 5 h. The powder is poured into a stainless steel mold after drying, then placed under hydraulic pressure to 500 Mpa for pressure forming. Later, the cold-pressed cylinder is placed in a high vacuum tube resistance furnace and sintered at 175° C. for 2 hours. After cooling to room temperature, it is formed into a cylinder under the hydraulic press. In this invention, graphene modified with Ag particles is selected as a strengthening material so as to improve the load-transfer between the graphene modified by nano-silver and the Sn matrix, aiming to achieve better strengthening effect.