公开(公告)号：US20170221778A1

公开(公告)日：2017-08-03

申请号：US15515126

申请日：2015-09-29

申请人： The Regents of the University of Colorado

发明人： Manjusha MEHENDALE ,  Michael KOTELYANSKII ,  Todd W. MURRAY ,  Robin MAIR ,  Priya MUKUNDHAN ,  Jacob D. DOVE ,  Xueping RU ,  Jonathan COHEN ,  Timothy KRYMAN

IPC分类号： H01L21/66 ,  G01N29/46 ,  G01N29/24 ,  H01L21/768 ,  G01N29/04

CPC分类号： H01L22/12 ,  G01N29/04 ,  G01N29/06 ,  G01N29/0681 ,  G01N29/069 ,  G01N29/07 ,  G01N29/2418 ,  G01N29/46 ,  G01N2291/0289 ,  H01L21/76898 ,  H01L22/20

摘要： Advanced interconnect technologies such as Through Silicon Vias (TSVs) have become an integral part of 3-D integration. Methods and systems and provided for laser-based acoustic techniques in which a short laser pulse generates broadband acoustic waves that propagate in the TSV structure. An optical interferometer detects the surface displacement caused by the acoustic waves reflecting within the structure as well as other acoustic waves traveling near the surface that has information about the structure dimensions and irregularities, such as voids. Features of voids, such as their location, are also identified based on the characteristics of the acoustic wave as it propagates through the via. Measurements typically take few seconds per site and can be easily adopted for in-line process monitoring.