公开(公告)号：US20230378146A1

公开(公告)日：2023-11-23

申请号：US18320102

申请日：2023-05-18

Applicant: Texas Instruments Incorporated

Inventor： John Carlo Molina ,  Julian Carlo Barbadillo ,  Chun Ping Lo ,  Sylvester Ankamah-Kusi ,  Rajen Murugan ,  Thomas Kronenberg ,  Jonathan Noquil ,  Guangxu Li ,  Blake Travis ,  Jason Colte

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L25/16 ,  H01L23/49822 ,  H01L28/40 ,  H01L23/3121 ,  H01L24/16 ,  H01L23/49562 ,  H01L21/4857 ,  H01L21/56 ,  H01L2224/16227

Abstract: An example microelectronic device package includes: a multilayer package substrate comprising routing conductors spaced by dielectric material, the multilayer package substrate having a device side surface and an opposing board side surface, and having a recessed portion extending from the device side surface and exposing routing conductors beneath the device side surface of the multilayer package substrate; a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to the routing conductors; a passive component mounted to the routing conductors exposed in the recessed portion of the multilayer package substrate; and mold compound covering the semiconductor die, the passive component, and a portion of the multilayer package substrate.

公开(公告)号：US20230197576A1

公开(公告)日：2023-06-22

申请号：US17556932

申请日：2021-12-20

Applicant: Texas Instruments Incorporated

Inventor： Thomas Kronenberg

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/49541 ,  H01L21/561 ,  H01L21/4842 ,  H01L23/49503

Abstract: A leadframe strip includes a two-dimensional mechanically interconnected array of leadframe units including a plurality of leadframe unit pairs, the leadframe strip having an overall length and an overall width. The plurality of leadframe unit pairs each include a first leadframe design including a first plurality of tie bars and a plurality of first leads, and a second leadframe design that is different from the first leadframe design including a second plurality of tie bars, and a plurality of second leads. The first plurality of tie bars and the second plurality of tie bars are configured together to provide a plurality of continuous metal support networks that span an entirety of the overall length or the overall width.