公开(公告)号：US20150008566A1

公开(公告)日：2015-01-08

申请号：US14320803

申请日：2014-07-01

申请人： Texas Instruments Incorporated

发明人： Mark A. Gerber ,  Mutsumi Masumoto ,  Kenji Masumoto ,  Anindya Poddar ,  Kengo Aoya ,  Masamitsu Matsuura ,  Takeshi Onogami

IPC分类号： H01L23/00 ,  H01L23/495

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/96 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A method for fabricating packaged semiconductor devices in panel format; placing a panel-sized metallic grid with openings on an adhesive tape (292); attaching semiconductor chips—coated with a polymer layer having windows for chip terminals —face-down onto the tape (293); laminating low CTE insulating material to fill gaps between chips and grid (294); turning over assembly to place carrier under backside of chips and lamination and to remove tape (295); plasma-cleaning assembly front side, sputtering uniform metal layer across assembly (296); optionally plating metal layer (297); and patterning sputtered layer to form rerouting traces and extended contact pads for assembly (298).

摘要翻译： 一种以面板格式制造封装半导体器件的方法; 将具有开口的面板尺寸的金属网格放置在胶带（292）上; 将具有用于芯片端子的具有窗口的聚合物层的半导体芯片附接到带（293）上; 层压低CTE绝缘材料以填充芯片和网格之间的间隙（294）; 翻转组件以将载体放置在芯片的背面和层压之下并去除带（295）; 等离子体清洁组件正面，横跨组装的溅射均匀金属层（296）; 可选地镀金属层（297）; 并且图案化溅射层以形成重新布线迹线和用于组装的扩展接触垫（298）。