公开(公告)号：US20240219425A1

公开(公告)日：2024-07-04

申请号：US18603091

申请日：2024-03-12

Applicant: Texas Instruments Incorporated

Inventor： Xinkun Huang ,  Dok Won Lee ,  Christopher Michael Ledbetter ,  Bret Alan Dahl ,  Roy Deidrick Solomon

IPC: G01R1/073 ,  G01R1/04 ,  G01R33/07

CPC classification number: G01R1/07342 ,  G01R1/0491 ,  G01R33/072

Abstract: A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.

公开(公告)号：US11927604B2

公开(公告)日：2024-03-12

申请号：US17313657

申请日：2021-05-06

Applicant: Texas Instruments Incorporated

Inventor： Xinkun Huang ,  Dok Won Lee ,  Christopher Michael Ledbetter ,  Bret Alan Dahl ,  Roy Deidrick Solomon

IPC: G01R33/12 ,  G01R1/04 ,  G01R1/073 ,  G01R33/07

CPC classification number: G01R1/07342 ,  G01R1/0491 ,  G01R33/072

Abstract: A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.

公开(公告)号：US20210356497A1

公开(公告)日：2021-11-18

申请号：US17313657

申请日：2021-05-06

Applicant: Texas Instruments Incorporated

Inventor： Xinkun Huang ,  Dok Won Lee ,  Christopher Michael Ledbetter ,  Bret Alan Dahl ,  Roy Deidrick Solomon

IPC: G01R1/073 ,  G01R1/04 ,  G01R33/07

Abstract: A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.