公开(公告)号：US20140175626A1

公开(公告)日：2014-06-26

申请号：US14189874

申请日：2014-02-25

Applicant: Texas Instruments Incorporated

Inventor： Donald C. Abbott ,  Ubol A. Udompanyavit ,  Brian E. Parks

IPC: H01L23/495

CPC classification number: H01L23/4952 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit package has a leadframe having an open space extending therethrough. An integrated circuit device is attached to a portion of the upper surface of the leadframe. A shunt is located within the open space such that it is not in contact with any portion of the leadframe.

Abstract translation: 集成电路封装具有引导框架，其具有延伸穿过其中的开放空间。 集成电路装置附接到引线框架的上表面的一部分。 分流器位于开放空间内，使得它不与引线框架的任何部分接触。