公开(公告)号：US20250006602A1

公开(公告)日：2025-01-02

申请号：US18753963

申请日：2024-06-25

Applicant: Tesla, Inc.

Inventor： William Thomas Chi ,  Utkarsh Raheja ,  Sesha Sai Srikant Sarma Gandikota ,  Steven Thomas Embleton

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/367 ,  H01L25/18 ,  H01L29/772

Abstract: The present disclosure relates to a semiconductor package. The semiconductor package includes a semiconductor die, molding material, and a conductive structure. The conductive structure is at least partly stacked with the semiconductor die, and the conductive structure includes a plurality of slots positioned around a point of the semiconductor die. The plurality of slots is configured to equalize thermal stresses during the operation of the semiconductor die about the point of the semiconductor die, where the thermal stresses are associated with coefficient of thermal expansion mismatches between the conductive structure and the molding material. In addition, at least a portion of the molding material is in contact with the conductive structure.