公开(公告)号：US20240290703A1

公开(公告)日：2024-08-29

申请号：US18658006

申请日：2024-05-08

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Kuo-Lung Pan ,  Yu-Chia Lai ,  Teng-Yuan Lo ,  Mao-Yen Chang ,  Po-Yuan Teng ,  Chen-Hua YU ,  Chung-Shi Liu ,  Hao-Yi Tsai ,  Tin-Hao Kuo

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/16

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L25/16 ,  H01L25/50

摘要： A chip package structure includes an interposer structure that contains a package-side redistribution structure, an interposer core assembly, and a die-side redistribution structure. The interposer core assembly includes at least one silicon substrate interposer, and each of the at least one silicon substrate interposer includes a respective silicon substrate, a respective set of through-silicon via (TSV) structures vertically extending through the respective silicon substrate, a respective set of interconnect-level dielectric layers embedding a respective set of metal interconnect structures, and a respective set of metal bonding structures that are electrically connected to the die-side redistribution structure. The chip package structure includes at least two semiconductor dies that are attached to the die-side redistribution structure, and an epoxy molding compound (EMC) multi-die frame that laterally encloses the at least two semiconductor dies.