公开(公告)号：US20250038073A1

公开(公告)日：2025-01-30

申请号：US18360666

申请日：2023-07-27

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ke-Han SHEN ,  Chih-Yuan CHEN ,  Jiung WU ,  Hung-Yi Kuo ,  Chung-Ju LEE ,  Tung-He CHOU ,  Ji CUI ,  Kuo-Chung YEE ,  Chen-Hua YU ,  Cheng-Chieh HSIEH ,  Yu-Jen LIEN ,  Yian-Liang KUO ,  Shih-Hao TSENG ,  Jen Yu WANG ,  Tzu-Chieh Chou

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L29/06 ,  H01L29/423 ,  H01L29/775

Abstract: A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.