公开(公告)号：US20240304455A1

公开(公告)日：2024-09-12

申请号：US18667585

申请日：2024-05-17

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yu-Ping TSENG ,  Ren-Hao JHENG

IPC分类号： H01L21/321 ,  B24B9/06 ,  B24B37/04 ,  B24B37/24 ,  B24B37/26

CPC分类号： H01L21/3212 ,  B24B9/065 ,  B24B37/044 ,  B24B37/24 ,  B24B37/26

摘要： The present disclosure provides an apparatus and a method for polishing a semiconductor substrate in semiconductor device manufacturing. The apparatus can include: a carrier configured to hold the substrate; a polishing pad configured to polish a first surface of the substrate; a chemical mechanical polishing (CMP) slurry delivery arm configured to dispense a CMP slurry onto the first surface of the substrate; and a pad conditioner configured to condition the polishing pad. In some embodiments, the pad conditioner can include: a conditioning disk configured to scratch the polishing pad; a conditioning arm configured to rotate the conditioning disk; a plurality of magnetic screws configured to secure the conditioning disk onto the conditioning arm and including a respective plurality of screw heads; and a plurality of blocking devices respectively positioned beneath the plurality of screw heads and configured to block debris particles from entering a respective plurality of screw holes.