公开(公告)号：US20240363586A1

公开(公告)日：2024-10-31

申请号：US18307793

申请日：2023-04-26

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Su-Chun Yang ,  Jih-Churng Twu ,  Jui Hsuan Tsai ,  Chiao-Chun Chang ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC分类号： H01L25/065 ,  H01L21/56 ,  H01L21/82 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

CPC分类号： H01L25/0652 ,  H01L21/561 ,  H01L21/565 ,  H01L21/82 ,  H01L23/3135 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/80 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L24/48 ,  H01L2224/08145 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/183

摘要： A semiconductor package includes a first integrated circuit, a plurality of second integrated circuits, at least one adhesion layer and a molding compound. The second integrated circuits are bonded onto the first integrated circuit. The at least one adhesion layer extends between the second integrated circuits and on sidewalls of the second integrated circuits. The molding compound extends between the second integrated circuits and on the at least one adhesion layer, wherein a surface of the at least one adhesion layer facing away from the first integrated circuit is substantially coplanar with a surface of the molding compound facing away from the first integrated circuit.