公开(公告)号：US09823585B2

公开(公告)日：2017-11-21

申请号：US14852805

申请日：2015-09-14

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Tsung Shih ,  Chieh-Jen Cheng ,  Jeng-Horng Chen ,  Chia-Chen Chen ,  Shinn-Sheng Yu ,  Anthony Yen ,  Wei-Chih Lai

IPC: G03B27/68 ,  G03B27/52 ,  G03F7/20

CPC classification number: G03F7/70641

Abstract: Systems and methods for monitoring the focus of an EUV lithography system are disclosed. Another aspect includes a method having operations of measuring a first shift value for a first patterned set of sub-structures of a focus test structure on a wafer and measuring a second shift value for a second patterned set of sub-structures of the test structure on the wafer. The test structure may be formed on the wafer using asymmetric illumination, with the first patterned set of sub-structures having a first pitch and the second patterned set of sub-structures having a second pitch that is different from the first pitch. The method may further include determining a focus shift compensation for an illumination system based on a difference between the first shift value and the second shift value.

公开(公告)号：US10067418B2

公开(公告)日：2018-09-04

申请号：US14275601

申请日：2014-05-12

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shu-Hao Chang ,  Chi-Lun Lu ,  Shang-Chieh Chien ,  Ming-Chin Chien ,  Jui-Ching Wu ,  Jeng-Horng Chen ,  Chieh-Jen Cheng ,  Chia-Chen Chen

IPC: B08B7/00 ,  G03F1/82

Abstract: A method of removing particles from a surface of a reticle is disclosed. The reticle is placed in a carrier, a source gas is flowed into the carrier, and a plasma is generated within the carrier. Particles are then removed from a surface of the reticle using the generated plasma. A system of removing particles from a surface includes a carrier configured to house a reticle, a reticle stocker including the carrier, a power supply configured to apply a potential between an inner cover and an inner baseplate of the carrier, and a gas source configured to flow a gas into the carrier. A plasma may be generated within the carrier, and particles can be removed from a surface of the reticle using the generated plasma. An acoustic energy source configured to agitate at least one of the source gas and the generated plasma may be provided to facilitate particle removal using an agitated plasma.

公开(公告)号：US20160291482A1

公开(公告)日：2016-10-06

申请号：US14852805

申请日：2015-09-14

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chih-Tsung Shih ,  Chieh-Jen Cheng ,  Jeng-Horng Chen ,  Chia-Chen Chen ,  Shinn-Sheng Yu ,  Anthony Yen ,  Wei-Chih Lai

IPC: G03F7/20

CPC classification number: G03F7/70641

Abstract: Systems and methods for monitoring the focus of an EUV lithography system are disclosed. Another aspect includes a method having operations of measuring a first shift value for a first patterned set of sub-structures of a focus test structure on a wafer and measuring a second shift value for a second patterned set of sub-structures of the test structure on the wafer. The test structure may be formed on the wafer using asymmetric illumination, with the first patterned set of sub-structures having a first pitch and the second patterned set of sub-structures having a second pitch that is different from the first pitch. The method may further include determining a focus shift compensation for an illumination system based on a difference between the first shift value and the second shift value.

Abstract translation: 公开了用于监测EUV光刻系统的焦点的系统和方法。 另一方面包括一种方法，该方法具有测量晶片上的聚焦测试结构的第一图案化组合子结构的第一移位值并测量第二图案化测试结构的子结构集合的第二移位值 晶圆。 可以使用不对称照明在晶片上形成测试结构，其中第一图案组的子结构具有第一间距，并且第二图案化的子结构组具有不同于第一间距的第二间距。 该方法还可以包括基于第一移位值和第二移位值之间的差异确定照明系统的聚焦偏移补偿。

公开(公告)号：US20150323862A1

公开(公告)日：2015-11-12

申请号：US14275601

申请日：2014-05-12

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Shu-Hao Chang ,  Chi-Lun Lu ,  Shang-Chieh Chien ,  Ming-Chin Chien ,  Jui-Ching Wu ,  Jeng-Horng Chen ,  Chieh-Jen Cheng ,  Chia-Chen Chen

IPC: G03F1/82 ,  B08B7/00

CPC classification number: G03F1/82 ,  B08B7/0021

Abstract: A method of removing particles from a surface of a reticle is disclosed. The reticle is placed in a carrier, a source gas is flowed into the carrier, and a plasma is generated within the carrier. Particles are then removed from a surface of the reticle using the generated plasma. A system of removing particles from a surface includes a carrier configured to house a reticle, a reticle stocker including the carrier, a power supply configured to apply a potential between an inner cover and an inner baseplate of the carrier, and a gas source configured to flow a gas into the carrier. A plasma may be generated within the carrier, and particles can be removed from a surface of the reticle using the generated plasma. An acoustic energy source configured to agitate at least one of the source gas and the generated plasma may be provided to facilitate particle removal using an agitated plasma.

Abstract translation: 公开了从掩模版的表面去除颗粒的方法。 将掩模版放置在载体中，源气体流入载体中，并且在载体内产生等离子体。 然后使用产生的等离子体从掩模版的表面除去颗粒。 从表面除去颗粒的系统包括构造成容纳掩模版的载体，包括载体的掩模版储存器，构造成在载体的内盖和内基板之间施加电位的电源，以及配置为 将气体流入载体。 可以在载体内产生等离子体，并且可以使用产生的等离子体从掩模版的表面除去颗粒。 可以提供构造成搅动源气体和所产生的等离子体中的至少一种的声能源，以促进使用搅拌等离子体的颗粒去除。