公开(公告)号：US20230067088A1

公开(公告)日：2023-03-02

申请号：US17461672

申请日：2021-08-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Han-De CHEN ,  Yun-Chen TENG ,  Chen-Fong TSAI ,  Jyh-Cherng SHEU ,  Huicheng CHANG ,  Yee-Chia YEO

IPC: H01L23/00 ,  H01L21/66 ,  H01L21/67 ,  H01L21/02 ,  B23K1/00

Abstract: The present disclosure provides a substrate bonding apparatus capable of temperature monitoring and temperature control. The substrate bonding apparatus comprises a fluid cooling module and a sensor module for detecting temperatures at multiple zones (e.g., two or more zones) within a substrate. The substrate bonding apparatus according to the present disclosure achieves temperature stabilization within the substrate. The substrate bonding apparatus further improves bonding process performance by reducing distortion residual, reducing bubbles on edges of the substrate, and reducing non-bonded area within the substrate.