公开(公告)号：US12138735B2

公开(公告)日：2024-11-12

申请号：US16559472

申请日：2019-09-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chung Chen ,  Yi-Shao Lin ,  Sheng-Tai Peng ,  Ya-Jen Sheuh ,  Hung-Lin Chen ,  Ren-Dou Lee

IPC: B24B37/20 ,  B24B37/013 ,  B24B37/04 ,  C09G1/02

Abstract: Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.

公开(公告)号：US20200164482A1

公开(公告)日：2020-05-28

申请号：US16559472

申请日：2019-09-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chung Chen ,  Yi-Shao Lin ,  Sheng-Tai Peng ,  Ya-Jen Sheuh ,  Hung-Lin Chen ,  Ren-Dou Lee

IPC: B24B37/20 ,  B24B37/013 ,  C09G1/02 ,  B24B37/04

Abstract: Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.