公开(公告)号：US20240379394A1

公开(公告)日：2024-11-14

申请号：US18783353

申请日：2024-07-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Huang CHEN ,  Chi-Hao KUNG ,  Yen-Yu CHEN

IPC: H01L21/673 ,  H01L21/324 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate boat for use in heat treatment of semiconductor wafers includes support rods and fingers for supporting a substrate in a horizontal orientation in process tools, e.g., furnaces. The substrate is supported in the substrate boat by groups of fingers lying in a common horizontal plane. The fingers contact the substrate at support locations on the back side of the substrate. The fingers have a plurality of different shapes and a substrate surface no contact region.

公开(公告)号：US20220102175A1

公开(公告)日：2022-03-31

申请号：US17039356

申请日：2020-09-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tung-Huang CHEN ,  Chi-Hao KUNG ,  Yen-Yu CHEN

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/687 ,  H01L21/324

Abstract: A substrate boat for use in heat treatment of semiconductor wafers includes support rods and fingers for supporting a substrate in a horizontal orientation in process tools, e.g., furnaces. The substrate is supported in the substrate boat by groups of fingers lying in a common horizontal plane. The fingers contact the substrate at support locations on the back side of the substrate. The fingers have a plurality of different shapes and a substrate surface no contact region.