公开(公告)号：US20230420438A1

公开(公告)日：2023-12-28

申请号：US17849300

申请日：2022-06-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tien-Chung YANG ,  Li-Hsien HUANG ,  Ming-Feng WU ,  Yao-Chun CHUANG ,  Jun HE

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L25/18 ,  H01L2224/29099 ,  H01L24/05 ,  H01L23/49827 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/27 ,  H01L24/32 ,  H01L24/29 ,  H01L2224/16145 ,  H01L2224/0401 ,  H01L2224/05582 ,  H01L2224/73204 ,  H01L2224/16227 ,  H01L2224/2761 ,  H01L2224/32225 ,  H01L24/16

Abstract: The present disclosure describes a structure that joins semiconductor packages and a method for forming the structure. The structure includes an adhesion layer in contact with a first semiconductor package and a first joint pad in contact with the adhesion layer. The structure further includes a film layer disposed on the first semiconductor package and the first joint pad, where the film layer includes a slanted sidewall, the slanted sidewall covers an end portion of the adhesion layer and a first portion of the first joint pad, and the slanted sidewall exposes a second portion of the first joint pad. The structure further includes a solder ball attached to the second portion of the first joint pad and a second joint pad of a second semiconductor package.