EUV RADIATION SOURCE FOR LITHOGRAPHY EXPOSURE PROCESS

    公开(公告)号:US20200045800A1

    公开(公告)日:2020-02-06

    申请号:US16149643

    申请日:2018-10-02

    Abstract: An extreme ultraviolet (EUV) lithography system is provided. The EUV lithography system includes the above-mentioned extreme ultraviolet (EUV) radiation source. The EUV lithography system further includes a collector configured to collect and reflect the EUV radiation and a mask stage configured to secure an EUV mask. The EUV lithography system also includes a wafer stage configured to secure a semiconductor wafer. In addition, the EUV lithography system includes one or more optical modules configured to direct the EUV radiation from the radiation source to image an integrated circuit (IC) pattern defined on the EUV mask onto the semiconductor wafer.

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